Patents Assigned to CO
  • Patent number: 12185543
    Abstract: A semiconductor device includes a substrate, gate electrodes stacked and spaced apart from each other in a first direction perpendicular to an upper surface of the substrate, channel structures penetrating the gate electrodes, extending in the first direction, and each including a channel layer, separation regions penetrating the gate electrodes, extending in the first direction and a second direction perpendicular to the first direction, and spaced apart from each other in a third direction perpendicular to the first direction and the second direction, and crack prevention layers disposed on at least a portion of the separation regions, wherein each of the separation regions includes a lower region and upper regions spaced apart from each other in the second direction on the lower region and protruding upwardly from the lower region, and wherein the crack prevention layers are in contact with upper surfaces of the upper regions.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: December 31, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sanghun Chun, Kwangyoung Jung, Youngji Noh, Junghwan Park, Jeehoon Han
  • Patent number: 12185483
    Abstract: A display device is provided. The display device includes a housing comprising a fixed part and a movable part, the movable part being movable relative to the fixed part; a first reel rotatably connected to the fixed part; a second reel parallel to the first reel, rotatably connected to the movable part, and provided with a plurality of first protrusions or a plurality of first grooves; and a flexible display panel with a first end fixed to the fixed part, a second end wound around the first reel, and a middle portion wound around the second reel, where the flexible display panel is provided with a plurality of second grooves matching the plurality of first protrusions or with a plurality of second protrusions matching the plurality of first grooves.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: December 31, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shangchieh Chu, Zongyuan Wang, Hong Zhu
  • Patent number: 12183747
    Abstract: To provide a miniaturized semiconductor device with low power consumption. A method for manufacturing a wiring layer includes the following steps: forming a second insulator over a first insulator; forming a third insulator over the second insulator; forming an opening in the third insulator so that it reaches the second insulator; forming a first conductor over the third insulator and in the opening; forming a second conductor over the first conductor; and after forming the second conductor, performing polishing treatment to remove portions of the first and second conductors above a top surface of the third insulator. An end of the first conductor is at a level lower than or equal to the top level of the opening. The top surface of the second conductor is at a level lower than or equal to that of the end of the first conductor.
    Type: Grant
    Filed: February 8, 2024
    Date of Patent: December 31, 2024
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yutaka Okazaki, Tomoaki Moriwaka, Shinya Sasagawa, Takashi Ohtsuki
  • Patent number: 12184481
    Abstract: An electronic device accesses a first wireless network provided by a first wireless access device; and the electronic device sends network configuration information of a second wireless access device to the first wireless access device when the electronic device determines, based on the first wireless network and stored historical information, that the electronic device meets a preset condition, where the preset condition is used to indicate that the electronic device has changed from accessing the second wireless access device to accessing the first wireless access device, the network configuration information is used to configure the first wireless access device, and the network configuration information includes a network name and a network password of a wireless network.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: December 31, 2024
    Assignee: HUAWEI TECHNOLOIGES CO., LTD.
    Inventor: Jingwei Qu
  • Patent number: 12183727
    Abstract: A flexible display device may include a display panel including a display area and a bending area extending from one side of the display area to be bent, a back plate disposed on a rear surface of the display panel, a cushion tape disposed on a rear surface of the back plate, a driver integrated circuit (IC) disposed in a pad portion extending from the bending area, and a functional tape adhered between the cushion tape and the back plate and disposed to face the driver integrated circuit, so that effects capable of improving an EMI shielding function with a low cost, together with an adhesive function, and deriving an optimum efficiency, may be provided.
    Type: Grant
    Filed: September 22, 2023
    Date of Patent: December 31, 2024
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Insik Shin, Jongseok Cha
  • Patent number: 12179260
    Abstract: A ventilating stopper rod has a temperature measurement function and is used for continuous casting. The stopper rod has a rod body, a rod head, a temperature measurement unit, a connecting pipe and exhaust passages; the rod body is a hollow structure; the upper end of the rod body is connected with the connecting pipe; the lower end of the rod body is connected with the rod head; the temperature measurement unit is used for measuring the temperature of the molten steel; the open end of the temperature measurement unit is connected with the rod head and communicates with the inner cavity of the rod body; the closed end of the temperature measurement unit extends out from the lower end of the rod head and is exposed from the rod head.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: December 31, 2024
    Assignee: SHENYANG TAIHE METALLURGICAL MEASUREMENT AND CONTROL TECHNOLOGIES CO., LTD.
    Inventors: Qixian Xie, Jiu Zhang
  • Patent number: 12179597
    Abstract: A hybrid drive module is disclosed.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: December 31, 2024
    Assignee: Valeo Kapec Co., Ltd.
    Inventors: Jungwoo Kim, Jinsu Park
  • Patent number: 12180109
    Abstract: Provided is a method of manufacturing a glass sheet having a through hole, including: a first step of preparing a glass sheet (1); and a second step of forming a through hole (2) in the glass sheet (1), wherein the first step includes, under conditions of: ? representing an inclination angle of an inner wall surface (2a) of the through hole (2) with respect to a sheet thickness direction; D representing a minimum hole width of the through hole (2); and an allowable variation range of the minimum hole width D being represented by A % of the minimum hole width D, preparing the glass sheet (1) for which a sheet thickness variation range ?T satisfies the following relationship when the through hole (2) is gradually widened toward only one side of the sheet thickness direction: ?T?(D×A/tan ?)/200.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: December 31, 2024
    Assignee: NIPPON ELECTRIC GLASS CO., LTD.
    Inventor: Takayuki Noda
  • Patent number: 12185625
    Abstract: An organic electroluminescent device having a light-emitting layer, wherein the light-emitting layer contains a host compound having a boron atom and an oxygen atom in the molecule as a first component, a thermally assisting delayed fluorescent material such that the energy difference ?EST between the excited singlet energy level and the excited triplet energy level is 0.20 eV or less as a second component, and a fluorescent material as a third component, and has a high light emission efficiency.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: December 31, 2024
    Assignees: KWANSEI GAKUIN EDUCATIONAL FOUNDATION, SK MATERIALS JNC CO., LTD.
    Inventors: Takuji Hatakeyama, Yasuhiro Kondo, Ryosuke Kawasumi
  • Patent number: 12181619
    Abstract: A method for determining neutron flux by utilizing a portable Radionuclide Identification Device (RID) as it is used in homeland security applications is provided. The RID has an inorganic crystal comprising iodine, a light detector and electronics for the evaluation of the output signals of the light detector. The method includes a step of detecting, with the light detector, light emitted by the crystal following the interaction of nuclear radiation with the crystal. The intensity of the light measured is a function of the energy deposed in the crystal by said nuclear radiation during the interaction with the crystal.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: December 31, 2024
    Assignee: TARGET SYSTEMELEKTRONIK GMBH &CO. KG
    Inventor: Jurgen Stein
  • Patent number: 12183679
    Abstract: An interconnect structure and an electronic apparatus including the interconnect structure are provided. The interconnect structure includes a conductive layer; a dielectric layer configured to surround at least a part of the conductive layer; and a diffusion barrier layer disposed between the conductive layer and the dielectric layer and configured to limit and/or prevent a conductive material of the conductive layer from diffusing into the dielectric layer, and at least one of the dielectric layer and the diffusion barrier layer includes a boron nitride layer of a low dielectric constant.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: December 31, 2024
    Assignees: Samsung Electronics Co., Ltd., UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Hyeonjin Shin, Minhyun Lee, Changseok Lee, Hyeonsuk Shin, Seokmo Hong
  • Patent number: 12184429
    Abstract: A method and an apparatus for sending hybrid automatic repeat request acknowledgement/negative acknowledgement information are disclosed, and relate to the communications field, to specify a mechanism for feeding back information indicating whether a decoding result of downlink data repeatedly transmitted in a slot is correct. The method includes: determining a first downlink data occasion set based on a time domain resource indicated by a time domain resource allocation (TDRA) table; determining a first downlink data occasion based on a start time domain resource for sending downlink data; adding feedback information (for example, information indicating whether a decoding result of the downlink data is correct) to a feedback location corresponding to the first downlink data occasion; determining a feedback slot based on a slot to which the start time domain resource for sending the downlink data belongs and a first offset K1; and feeding back a HARQ-ACK codebook in the feedback slot.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: December 31, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shengyu Li, Lei Guan, Ruixiang Ma
  • Patent number: 12185161
    Abstract: Embodiments of this application provide a scheduling request processing method and a terminal device. The scheduling request processing method includes: determining, by a terminal device, whether there is a regular BSR associated with a first logical channel that is triggered and has not been canceled; and if a regular BSR associated with the first logical channel is triggered and has not been canceled, and the terminal device has no uplink resource available to transmit data of the first logical channel, and a first timer of the terminal device is not running, triggering, by the terminal device, an SR, where the first timer is configured to delay transmission of the SR.
    Type: Grant
    Filed: March 18, 2024
    Date of Patent: December 31, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haibo Xu, Yiru Kuang, Jian Wang, Haifeng Yu
  • Patent number: 12181643
    Abstract: A photographing optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has a convex object-side surface. The second lens element with negative refractive power has a convex object-side surface and a concave image-side surface. The third lens element has refractive power. The fourth lens element has refractive power, and an object-side surface and an image-side surface thereof are aspheric. The fifth lens element with negative refractive power has a concave image-side surface, wherein an object-side surface and the image-side surface thereof are aspheric, and at least one of the object-side surface and the image-side surface thereof has at least one inflection point.
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: December 31, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Lin-Yao Liao, Hsin-Hsuan Huang
  • Patent number: 12185185
    Abstract: An electronic device may include a communication module, a display module, at least one processor, and a memory. The at least one processor may: obtain state information of a first external electronic device on the basis of a first signal broadcast by the first external electronic device; when a control request for the first external electronic device is inputted, check whether the first external electronic device is connected to a second external electronic device through a common channel, on the basis of the state information; when the first external electronic device is connected to the second external electronic device through a common channel, transmit a control command corresponding to the control request by connecting to the first external electronic device using a dedicated channel. Other embodiments are possible for a method for managing a wireless connection of an electronic device and a device supporting the same.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: December 31, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Seungtaek Chung
  • Patent number: 12185456
    Abstract: A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: December 31, 2024
    Assignees: First Hi-tec Enterprise Co., Ltd., NEXCOM International Co., Ltd., Industrial Technology Research Institute
    Inventors: Min-Lin Lee, Sheng-Che Hung, Ching-Shan Chang, Ying-Tsuen Liou
  • Patent number: D1055513
    Type: Grant
    Filed: August 8, 2024
    Date of Patent: December 31, 2024
    Assignee: Shenzhen Junsen Trading Co., Ltd.
    Inventor: Junyong Chen
  • Patent number: D1055901
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: December 31, 2024
    Assignee: WINNERS' SUN PLASTIC & ELECTRONIC (SHENZHEN) CO. , LTD.
    Inventors: Yibing Peng, Jun Zeng, Zhiliang Wu
  • Patent number: D1056001
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: December 31, 2024
    Assignee: Shenzhen Anker Smart Technology Co., Ltd
    Inventors: Mingshan Wang, Shenghui Jia
  • Patent number: D1056334
    Type: Grant
    Filed: January 6, 2023
    Date of Patent: December 31, 2024
    Assignee: DONGGUAN ZHIFEI ELECTRONIC TENHNOLOGY CO., LTD.
    Inventor: Qun Yang