Abstract: In general, embodiments of the present invention provide systems and methods for a touch display panel and a touch display device including a touch display panel. The touch display panel includes: a substrate, and a common electrode layer located on the substrate. The common electrode layer includes multiple touch electrodes insulated from each other. Each of the touch electrodes is electrically connected to a driving circuit via at least one touch lead. A part of the touch electrodes are divided into multiple sub-electrodes by touch leads adjacent to the divided touch electrodes. The sub-electrodes of each of the touch electrodes are electrically connected to each other via at least one bridge, to reduce parasitic capacitances between the touch leads and the touch electrodes and alleviate an influence from the parasitic capacitances on touch performance.

Abstract: An array substrate and a display panel. The array substrate includes: a plurality of data lines and a plurality of scan lines; at least one sub-pixel unit defined by the data lines and the scan lines; and a plurality of touch electrodes, comprising drive electrodes and touch sensing electrodes intersecting the drive electrodes; wherein, in a touch phase, at least one of the touch electrodes is electrically connected with the corresponding data line, so that a driving signal is transmitted to or a sense signal is received from the at least one of the touch electrodes via the corresponding data line electrically connected with the at least one of the touch electrodes.

Abstract: Provided is a display device including a display panel having a display area including a plurality of pixel columns, the display device including: a first pixel column including i pixels (i is a natural number) from among the plurality of pixel columns; a second pixel column including j pixels (j is a different natural number than i) from among the plurality of pixel columns; a first data line connected to the i pixels in the first pixel column, and to k pixels (k is a smaller natural number than j) from among the j pixels in the second pixel column; a second data line connected to j minus k (j-k) pixels from among the j pixels in the second pixel column; and gate lines connected to pixels in the first pixel column and the second pixel column.

Abstract: The present invention provides a method of reworking an array substrate including a gate metal layer, a gate insulation layer (G1), a semiconductor layer, a source/drain metal layer, a lower passivation layer, a common electrode layer, an upper passivation layer, and a pixel electrode layer sequentially formed therein. By using a rework mask protecting a jumping passivation hole area in reworking the pixel electrode layer, the method can maintain the electric connection between the common electrode layer and the rework pixel electrode pattern in the jumping passivation hole area even after the pixel electrode rework process, to thereby reduce the occurrence of failure and the reduction of throughput due to the rework process.

Abstract: The present disclosure relates to a fan-out semiconductor package and a method of manufacturing the same. The fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on one surface and the other surface of the first insulating layer opposing the one surface thereof, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer. A fan-out semiconductor package may include one or more connection units instead of the first connection member.

Abstract: A mobile application development system includes a developer portal that receives a first application from a first developer and provides a routing library to the first developer for incorporation into the first application. An offline analysis system executes the first application and, during execution, monitors a sequence of user interface (UI) events initiated by an operator starting from an initial state and proceeding to a first state. The offline analysis system stores the sequence of UI events as a first data structure corresponding to the first state. The routing library includes instructions that, subsequent to installation of a copy of the first application in a user device, receive a link from an operating system of the user device identifying the first state and, based on the first data structure corresponding to the first state, replay, in order, each UI event from the sequence of UI events to the first application.

Abstract: A connector is disclosed. The connector comprises a case having a top case and a bottom case and a partition plate disposed between the top case and the bottom case separating an inside space of the case into a plurality of receiving chambers. The bottom case has a first slot. The partition plate has a first side edge facing the bottom case and a first elastic hook formed on the first side edge. The first elastic hook is inserted into and elastically engages the first slot to connect the partition plate to the bottom case.

Abstract: A mobile device for executing multiple applications is provided. The mobile device includes a touch screen for displaying a first window where a first application is executed, a second window where a second application different from the first application is executed, and a controller for displaying execution keys for executing the multiple applications, determining whether a simultaneous execution input for the first application and the second application is input or not, and if the simultaneous execution input is input then displaying the first application on the first window and the second application on the second window.

Abstract: A touch panel includes a cover substrate and a substrate over the cover substrate. A first pad part is provided on one surface of the cover substrate and a second pad part is provided on one surface of the substrate. A first distance from an end of the cover substrate to the first pad part is longer than a second distance from the end of the cover substrate to an end of the substrate.

Abstract: Electrode portions located on both ends are set to detection electrode portions, ground electrode portions are set on the inside thereof, and a plurality of central electrode portions are set to driving detection portions. A coordinate position of a finger can be obtained based on an output difference between the detection electrode portions, and a vertical distance can be obtained based on an output sum. When the vertical distance of the finger is shorter than a first threshold, switching is performed so that an interval between the detection electrode portions is shortened, and when the finger approaches, a touch detection mode is set.

Abstract: Provided is an integrated fan-out package including a die, a first redistribution circuit structure, a second redistribution circuit structure, a plurality of solder joints, a plurality of conductive posts, and an insulating encapsulation. The first redistribution circuit structure and the second redistribution circuit structure are formed respectively over a back surface and an active surface of the die to sandwich the die. The solder joints are formed aside the die and connected to the first redistribution circuit structure. The conductive posts are formed on the solder joints and connected to the second redistribution circuit structure, and connected to the first redistribution circuit structure through the solder joints. A plurality of sidewalls of the die, a plurality of sidewalls of the conductive posts, and a plurality of sidewalls of the solder joints are encapsulated by the insulating encapsulation. A fabricating process of the integrated fan-out package is also provided.

Abstract: A display apparatus includes a display panel and a variable resistance area. The display panel includes a foldable area, a non-foldable area, and a folding axis. The variable resistance area may overlap the foldable area and includes a first resistance part and a second resistance part. The first resistance part has a first resistance when the display panel is folded with a curvature greater than a first curvature and a second resistance different from the first resistance when the display panel is folded with a curvature less than the first curvature. The second resistance part has a third resistance when the display panel is folded with a curvature greater than a second curvature and a fourth resistance different from the third resistance when the display panel is folded with a curvature less than the second curvature. The second curvature may be greater than the first curvature.

Abstract: A method for detecting a substrate crack, a substrate, and a detection circuit. A non-closed test line having an opening is peripherally disposed along an edge of a glass substrate of a TFT substrate. Whether an edge of the TFT substrate has a crack or chip can be determined by measuring whether the test line is on or off. In this way, a detection omission can be avoided, detection efficiency is improved, and after the TFT substrate is used to assemble a liquid crystal module or the liquid crystal module is used to assemble a complete device, whether the edge of the TFT substrate in the liquid crystal module has a crack or chip can also be detected.

Abstract: A second core block is stacked on a first filler-vestige-accommodating steel sheet along a rotational axis and has a plurality of second magnet insertion holes. Each of the plurality of second magnet insertion holes is defined by a second inner wall. Each of a plurality of second permanent magnets is inserted into each of the plurality of second magnet insertion holes. Each of second spaces is provided between each of the plurality of second permanent magnets and the second inner wall. The filler fills the second spaces. The plurality of second magnet insertion holes have a plurality of second filler injection portions, respectively, via which the filler is injected into the plurality of second magnet insertion holes. The first filler-vestige-accommodating steel sheet has a plurality of first hole portions opposite to the plurality of second filler injection portions, respectively.

Abstract: The present invention discloses a method and system for recognizing a user activity type, where the method includes: collecting an image of a location in which a user is located; extracting, from the image, characteristic data of an environment in which the user is located and characteristic data of the user; and obtaining, by recognition, an activity type of the user by using an image recognition model related to an activity type or an image library related to an activity type and the characteristic data.

Abstract: A control method and display apparatus for providing various types of content is provided. The display apparatus includes a display unit which displays an image of contents; a storage unit which stores information regarding the contents; a UI generation unit which generates UIs regarding the contents; and a controller which shuts down a first content being executed, storing information regarding the shut down first content and controls generation and display of a UI regarding the first content on the display unit, when running a second content different from the first content, while the first content is running. The control method includes running contents and displaying the contents; running a second content that is different from a first content being run, according to a user input; shutting off the first content before running the second content; storing the first content; and generating and displaying a UI regarding the first content.

Abstract: A semiconductor device includes a semiconductor chip including a semiconductor substrate, an element formed in an element forming region of the semiconductor substrate, and a through-via penetrating across a front surface and a rear surface of the semiconductor substrate while avoiding the element forming region of the semiconductor substrate to form a conductive path between the front surface and the rear surface; a circuit component mounted on a circuit component connection surface at the same side as the front surface of the semiconductor substrate of the semiconductor chip; and an external connection members formed on the rear surface of the semiconductor substrate.