Abstract: Example embodiments provide for an optical lens assembly and imaging lens with IR light filtering. The lens comprises a body having two surfaces and a plurality of layers of optical thin film layered along a direction formed on at least one surface. The optical thin films comprise less than 20 layers and thicker than 400 nm and thinner than 2000 nm thickness. Through the alternately layered layers of optical thin film, the transmittance of the lens for incident light in infrared ray band is reduced. Therefore, the infrared ray is mostly filtered without use of an additional infrared ray filter.

Abstract: Provided is a compound represented by formula (1a) or a pharmacologically acceptable salt thereof, which can be used as a phosphodiesterase (PDE) inhibitor. R1 to R6 in the formula each independently represent an alkyl group or the like.

Abstract: A visibility improvement method using gaze tracking includes detecting a gaze of a user using a camera; determining a focus object at which the user gazes from among at least one object viewed through a display unit of an electronic device; and displaying, on the display unit, an image with high visibility that corresponds to the focus object and has higher visibility than the focus object.

Abstract: A tritium substitution method having a process of adding an organic substance including at least one of an organic acid, an organic acid alkali salt, a water-soluble amino acid, an organic acid to which a water-soluble amino acid alkali salt is added, an organic acid alkali salt, a water-soluble amino acid, and a water-soluble amino acid alkali salt, to radioactive substance-contaminated water containing tritium, a tritium substitution process of circulating fine bubbles in the contaminated water in which the organic substance has been added to cause a reaction of substituting hydrogen in the ? position of a carboxylic acid group by tritium through an interface of the fine bubbles to produce a tritium-substituted product.

Abstract: A rotary compressor, comprising: a housing, comprising a lubricant oil storage part for containing lubricating oil; a compression mechanism disposed in the housing; a driving mechanism driving the compression mechanism, the driving mechanism comprising a rotation shaft, through-holes extending along the axial direction of the rotating shaft are disposed inside the rotating shaft, and the rotation shaft is in fluid connection with the lubricating oil storage part via the through-holes; and an oil level sensor in fluid connection with the through-holes inside the rotation shaft via a pressurized collection channel. Also disclosed is a rotation mechanism, comprising an oil level sensor in fluid connection with the through-holes inside the rotation shaft via the pressurized collection channel. Accurate and reliable detection of the lubricating oil in a compressor can be done using the pressurized collection channel and the oil level sensor, thus greatly saving cost and improving compressor reliability.

Abstract: Disclosed herein is a display apparatus having a cooling path provided to enhance cooling efficiency. The display apparatus includes a display panel configured to display images; a light source configured to radiate light toward the display panel; a bottom chassis disposed in rear of the light source; a case provided in rear of the bottom chassis; a circulative cooling path provided as to have air circulated surroundings of the bottom chassis.

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and the first connection member includes a coil pattern layer electrically connected to the connection pads of the semiconductor chip.

Abstract: Provided are semiconductor packages having through electrodes and methods of fabricating the same. The method may include may include forming a wafer-level package including first semiconductor chips stacked on a second semiconductor chip, forming a chip-level package including fourth semiconductor chips stacked on a third semiconductor chip stacking a plurality of the chip-level packages on a back surface of the second semiconductor substrate of the wafer-level package, polishing the first mold layer of the wafer-level package and the first semiconductor chips to expose a first through electrodes of the first semiconductor chip, and forming outer electrodes on the polished first semiconductor chips to be connected to the first through electrodes, respectively.

Abstract: A synchronous rectifier includes: a rectifying circuit including transistors, the rectifying circuit being configured to generate rectified power by rectifying input power input to an input terminal of the rectifying circuit depending on switching operations of the transistors, and output the rectified power to an output terminal of the rectifying circuit; and a controller configured to apply a gate signal to each of the, and adjust a pulse width of the gate signal depending on a difference between the input power and the gate signal.

Abstract: A semiconductor device is provided that includes a first chip that generates a single signal by connecting a first signal line and a second signal line, to which differential signals are respectively provided, and outputs the single signal to a third signal line. The first chip is driven by a first power supply voltage. The semiconductor device also includes a second chip comprising an analog-to-digital converter (ADC) that receives the single signal through the third signal line, compares the single signal with a reference voltage, and outputs a digital signal based on the comparison. The semiconductor device also includes a controller that monitors the digital signal and adjusts the reference voltage to be approximately equivalent to the first power supply voltage.

Abstract: Embodiments of the present invention relate to a thin film transistor array panel and a display device including the same. An exemplary embodiment of the present invention provides a thin film transistor array panel and a display device including the same, including: an insulation substrate including an upper surface and a lower surface; a light blocking member disposed on or facing the upper surface of the insulation substrate and defining a plurality of openings; and a thin film transistor disposed on the upper surface of the insulation substrate. The insulation substrate may include a plurality of recesses formed in the opening in the lower surface of the insulation substrate, each recess positioned to correspond to one of the openings.

Abstract: At least one of a center electrode and a ground electrode of a spark plug includes an electrode body, an electrode tip, and a welded portion formed between the electrode body and the electrode tip. The electrode tip includes a cover layer that covers at least a side surface of a tip body, and the cover layer is formed of IrAl. On a section formed by cutting the electrode tip near a boundary with the welded portion, an area of the tip body is represented by Sa. An area of a projection on the section of a non-contact portion of an opposite surface of the tip body not in contact with the welded portion is represented by Sb. In this case, Sa?Sb corresponds to 35% or more of Sa.

Abstract: An assembling structure of double stroller comprises a first assembling part, a second assembling part and a third assembling part. The first assembling part comprises a first seat, two first frames, a handle, and a first accommodation region allowed for the first seat to be disposed. The second assembling part comprises a second seat, two second frames, and a plurality of wheels, as well as a second accommodation region allowed for the second seat to be disposed. The third assembling part comprises first connecting parts, each being connected to each of the first frames at one end far away from the handle, and second connecting parts, each being connected to each of the second frames at one end far away from the second seat. Moreover, each of the first frames is inclined with respect to each of the second frames to form an L-shaped installation.

Abstract: In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.

Abstract: An aqueous liquid preparation containing (+)-(S)-4-[4-[(4-chlorophenyl)(2-pyridyl)methoxy]piperidino]butyric acid or a pharmacologically acceptable acid addition salt thereof, which is stabilized with a water-soluble metal chloride, is provided.

Abstract: Embodiments of the disclosure provide a backlight module using MJT LEDs and a backlight unit including the same. More specifically, embodiments of the disclosure provide a backlight module, which includes MJT LEDs configured to increase an effective light emitting area of each of light emitting cells and optical members capable of uniformly dispersing light emitted from the MJT LEDs. In addition, embodiments of the disclosure provide a backlight unit using the backlight module, thereby reducing the number of LEDs constituting the backlight unit while allowing operation at low current.

Abstract: A carburetor base of an engine defines an axial through hole and a pulsation hole channel. An anti-blocking component is mounted inside the axial through hole and defines an air inlet channel. The air inlet channel communicates with the pulsation hole channel so as to avoid blocking of condensed fuel oil inside the pulsation hole channel.

Abstract: It is an object to provide a highly reliable semiconductor device with good electrical characteristics and a display device including the semiconductor device as a switching element. In a transistor including an oxide semiconductor layer, a needle crystal group provided on at least one surface side of the oxide semiconductor layer grows in a c-axis direction perpendicular to the surface and includes an a-b plane parallel to the surface, and a portion except for the needle crystal group is an amorphous region or a region in which amorphousness and microcrystals are mixed. Accordingly, a highly reliable semiconductor device with good electrical characteristics can be formed.

Abstract: A directed epitaxial heterojunction bipolar transistor (HBT) structure is directly or indirectly formed on a GaAs substrate that is formed by a (100) face towards a (111)B face with an angle of inclination between 0.6° and 25°, and includes a sub-collector layer, a collector, a base layer, an emitter layer, an emitter cap layer and an ohmic contact layer, which are sequentially formed on the substrate. A tunnel collector layer formed by InGaP or InGaAsP is provided between the collector layer and the base layer. Since an epitaxial process is performed on the substrate from a (100) face towards a (111)B face with an angle of inclination between 0.6° and 25°, indium and gallium contained in InGaP or InGaAsP are affected by the ordering effect such that InGaP or InGaAsP used in the emitter layer and/or the tunnel collector layer has a higher electron affinity or a smaller bandgap.

Abstract: The disclosure relates to a method and device for call forwarding. The method comprises: receiving a calling number of an incoming call; forwarding or holding the calling number according to a preset multi-call forwarding rule. The disclosure increases the call forwarding flexibility of mobile terminals such as mobile phone, and provides convenience to users.