Abstract: A printed circuit board includes a substrate including a plurality of wiring layers; a first metal post disposed on the substrate and connected to at least a portion of an uppermost wiring layer among the plurality of wiring layers; a second metal post disposed on the substrate and connected to at least another portion of the uppermost wiring layer among the plurality of wiring layers; a resist layer disposed on the substrate and embedding at least a portion of each of the first and second metal posts; and a metal via penetrating through the resist layer on the second metal post and connected to the second metal post.

Abstract: Provided are a plated steel sheet for hot press forming including: a base steel sheet containing, by wt %, 0.14 to 0.5% of C, 0.001 to 1% of Si, 0.3 to 4% of Mn, 0.001 to 0.015% of P, 0.0001 to 0.02% of S, 0.001 to 0.1% of Al, 0.001 to 1% of Cr, 0.001 to 0.02% of N, 0.1% or less of Ti, 0.01% or less of B, 0.005 to 0.1% of Sb, and a balance of Fe and unavoidable impurities; an aluminum or aluminum alloy plating layer provided on at least one surface of the base steel sheet; and a Sb-rich layer provided between the base steel sheet and the plating layer, wherein the plated steel sheet for hot press forming satisfies the following Relational Expressions 1-1 and 1-2, a hot press formed member manufactured using the same, and methods for manufacturing the plated steel sheet for hot press forming and the hot press formed member. [Relational Expression 1-1] Sb max Sb coat ? 1.2 [Relational Expression 1-2] ( S ? b max - Sb c ? o ? a ? t ) 2 × ? ? t ? 0.

Abstract: A nozzle plate defines at least one nozzle connected to the nozzle plate at a base, wherein the at least one nozzle has a height and a top having an inner width and an outer width, wherein a ratio of the height to the inner width is greater than 5, and wherein the nozzle plate comprises a borosilicate glass. The nozzle plate is formed via a method including providing a silicon wafer having a surface; providing a borosilicate glass wafer having a surface; etching the surface of the silicon wafer to form a plurality of trenches in the surface; anodically bonding the etched surface of the silicon wafer to the surface of the borosilicate glass wafer to form a two layer composite; heating the two layer composite at a temperature of at least about 750° C.; and releasing the silicon wafer from the borosilicate glass to form the nozzle plate.

Abstract: A method of transferring vehicle communication content. The apparatus includes a surrounding-environment detection unit configured to detect a surrounding-environment information of a vehicle, a communication content transfer unit provided on at least one of a front side, a rear side, and a lateral side of the vehicle and configured to output sound or light; and a controller configured to recognize an object on the basis of the surrounding-environment information of the vehicle, to rotate the communication content transfer unit in a direction toward the object, depending on whether or not communication content needs to be transferred to the recognized object, and to output the communication content containing warning information or guide information through the communication content transfer unit.

Abstract: There is provided an imaging lens with excellent optical characteristics which satisfies demand of a low profile and a low F-number. An imaging lens comprises in order from an object side to an image side, a first lens with positive refractive power, a second lens with positive refractive power, a third lens with negative refractive power, a fourth lens, a fifth lens with positive refractive power, a sixth lens with positive or negative refractive power, and a seventh lens with negative refractive power, wherein said first lens is formed in a meniscus shape having an object-side surface being convex in a paraxial region, said second lens has an image-side surface being concave in a paraxial region, said sixth lens has an image-side surface being concave in a paraxial region, and said seventh lens has an image-side surface being concave in a paraxial region, and predetermined conditional expressions are satisfied.

Abstract: A semiconductor package includes a substrate, a semiconductor stack mounted on the substrate, and a stiffener surrounding the semiconductor stack, the stiffener having an octagonal shape at an edge of an upper surface thereof. A minimum distance from one angular point of an upper surface of the substrate to the stiffener is determined based on the thickness of the substrate.

Abstract: A hydrogen storage alloy suitable for a negative electrode of an on-board alkaline storage battery, an alkaline storage battery using this hydrogen storage alloy, and a vehicle; wherein a fine-grained hydrogen storage alloy is used for an alkaline storage battery that has a crystal structure of an A2B7-type structure as a main phase and is represented by a general formula: (La1-aSma)1-bMgbNicAldCre (where suffixes a, b, c, d, and e meet the following conditions: 0?a?0.35, 0.15?b?0.30, 0.02?d?0.10, 0?e?0.10, 3.20?c+d+e?3.50, and 0<a+e), and an alkaline storage battery using this hydrogen storage alloy for a negative electrode. A vehicle also includes this alkaline storage battery as an electricity supply source for a motor.

Abstract: The present invention discloses an outer-rotor brushless motor and a housing thereof. The housing is applicable to an outer-rotor brushless motor. The outer-rotor brushless motor includes a spindle, a stator holder mounted on a lower portion of the spindle through a bearing, and an outer rotor assembly fixedly mounted on an upper portion of the spindle. The housing comprises a cavity with a bottom being open, and covers the outer rotor assembly. At least one platform extends outwards from a bottom of a side wall of the housing, and is detachably fixed to the stator holder to form air inlet gaps. Multiple air outlet openings corresponding to the outer rotor assembly are formed in the side wall of the housing in a circumferential direction. The motor can be effectively protected and cooled.

Abstract: A memory device includes a semiconductor substrate and a memory cell at a memory region of the semiconductor substrate. A memory cell includes a memory portion of the semiconductor substrate, a tunneling layer, a storage layer, a first electrode, and a second electrode. The tunneling layer is over the memory portion of the semiconductor substrate. The storage layer is over and in contact with the tunneling layer. The first electrode is over the storage layer. The second electrode is over and in contact with the tunneling layer but is spaced apart from the storage layer.

Abstract: A display device includes a substrate including a first surface, and a second surface opposite the first surface, and defining a through portion passing therethrough, a pixel array including a plurality of pixels surrounding the through portion at the first surface, a plurality of scan lines extending along a first direction for providing scan signals to the pixels, and a plurality of data lines extending along a second direction crossing the first direction for providing data signals to the pixels, the plurality of data lines including first and second data lines adjacent the through portion at different layers, and having at least a portion thereof curved along a perimeter of the through portion.

Abstract: A compound represented by formula (1): wherein Ar1 represents a group represented by formula (3); Ar2 represents a group selected from a group represented by formula (3) and a substituted fluorenyl group: and R1, R2, R5 and R6 are as defined in the description is provided. An electroluminescence device which contains the compound of formula (1) is also provided.

Abstract: A Christmas LED bulb manufacturing process includes: taking a conductive wire: taking a conductive wire with a preset length, the conductive wire being a Dumet wire or a platinum wire; removing impurities: removing foreign matters and impurities on a surface of the conductive wire; welding a chip: welding and fixing a LED chip to the conductive wire after impurity removal; sealing: after the chip is welded, injecting one of silica gel, resin and silica gel, or a mixture of resin and a high thermal conductivity material into the LED chip to wrap the LED chip; assembling: inserting the sealed LED chip into a glass tube; and performing glass-sealing: melting two ends of the glass tube for sealing and molding.

Abstract: A nitride semiconductor device 1 includes a first nitride semiconductor layer that constitutes an electron transit layer, a second nitride semiconductor layer that is formed on the first nitride semiconductor layer, is larger in bandgap than the first nitride semiconductor layer, and constitutes an electron supply layer, a gate portion that is formed on the second nitride semiconductor layer, and a source electrode and a drain electrode that, on the second nitride semiconductor layer, are opposingly disposed across the gate portion. The gate portion includes a third nitride semiconductor layer of a ridge shape that is formed on the second nitride semiconductor layer and contains an acceptor type impurity and a gate electrode that is formed on the third nitride semiconductor layer. A film thickness of the third nitride semiconductor layer is greater than 100 nm.

Abstract: A connector includes plural terminals, a housing holding the terminals, and an inner shield. The connector is configured to be connected to a mating connector by moving toward the mating connector in a first direction relatively with respect to the mating connector. The terminals include two terminals arranged on both sides of the inner shield in a second direction perpendicular to the first direction. The inner shield includes a base extending in a third direction perpendicular to the first direction and the second direction, and an extension protruding from the base. The housing includes a shield holder holding the extension. This connector reduces noise propagation between the terminals.

Abstract: The present invention relates to an organic light emitting device. In particular, the present invention relates to an organic light emitting diode and an organic light emitting device each of which includes at least one emitting material layer comprising an anthracene-based host substituted with at least one deuterium and a boron-based dopant, at least one electron blocking layer comprising an amine-based compound substituted with aryl group, and optionally at least one hole blocking layer comprising at least one of an azine-based compound and a benzimidazole-based compound. The organic light emitting diode and the organic light emitting device has improved luminous efficiency and enhanced luminous lifespan.

Abstract: A biocompatible magnetic material containing an iron oxide nanoparticle and one or more biocompatible polymers, each having formula (I) below, covalently bonded to the iron oxide nanoparticle: in which each of variables R, L, x, and y is defined herein, the biocompatible magnetic material contains 4-15% Fe(II) ions relative to the total iron ions. Also disclosed in a method of preparing the biocompatible magnetic material.

Abstract: The present disclosure discloses a master node, a secondary node and a user equipment in a mobile communication network and communication methods thereof.

Abstract: A film peeling apparatus includes: a moving member; a first rod having a first contact portion at a lower end that contacts an upper surface of a film; a second rod having a second contact portion at a lower end; and a support portion supporting the first and second rods such that the first and the second rods move in a vertical direction with a movement of the moving member in the vertical direction. The first contact portion has a suction portion that sucks the film, the second contact portion has a sliding portion so that the film can be moved in a horizontal direction while the film is pressed by the second rod. When the moving member moves, the support portion support the first rod and the second rod so that the second rod starts to rise after the first rod starts to rise.

Abstract: The present disclosure provides a microphone, comprising a vibration pickup assembly configured to generate vibration; at least two acoustoelectric conversion elements configured to respectively receive the vibration of the vibration pickup assembly to generate an electrical signal; at least one sampling module configured to convert electrical signals output by different acoustoelectric conversion elements of the at least two acoustoelectric conversion elements into digital signals, wherein, each of the at least two acoustoelectric conversion element has a resonant frequency, and a difference between resonant frequencies of two of the at least two acoustoelectric conversion elements is greater than 1000 Hz.

Abstract: Engine control apparatus includes: an engine including an injector and ignition plug, and a controller configured to control the injector and ignition plug to switch combustion mode to a second homogenous charge compression ignition combustion of reformed fuel with ignition at required torque less than a first predetermined value, to a first homogenous charge compression ignition combustion of reformed fuel, obtained by reforming a portion of gasoline fuel into peroxide, without ignition at required torque more than the first predetermined value and less than a second predetermined value, to spark ignition combustion of gasoline with ignition at required torque more than the second predetermined value and less than a third predetermined value, and to diffusion combustion of reformed fuel without ignition at required torque more than the third predetermined value.