Patents Assigned to CO
  • Patent number: 11812541
    Abstract: An electronic component package includes an electronic component storage container including a main body with recesses to store electronic components positioned along a longitudinal direction of the main body and including openings on one side in a height direction of the main body, a cover sheet to cover the openings of the recesses and removably attached to the main body, and a cover positioned such that the cover sheet is between the cover and the main body, and electronic components stored in the recesses of the electronic component storage container, the electronic component package has a volume filling rate of the electronic components in at least one of the recesses of about 50% or higher.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: November 7, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro Shimizu, Kiyoyuki Nakagawa
  • Patent number: 11812179
    Abstract: An apparatus for controlling an operation of a vehicle according to an embodiment of the present disclosure includes an image driver that drives a camera such that an image is photographed at a predetermined photographing interval, a driver that drives an LED light source at a predetermined lighting interval, and a controller that changes the lighting interval of the LED light source to a multiple of the photographing interval after calculating the photographing interval when flickering is detected in the image photographed through the camera.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: November 7, 2023
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventor: Myeong Je Kim
  • Patent number: 11808922
    Abstract: A camera optical lens includes first to sixth lenses. The camera optical lens satisfies: ?3.00?f1/f??1.50; 0.10?(R5+R6)/(R5?R6)?1.00; and 1.00?d8/d10?2.50, where f denotes a focal length of the camera optical lens; f1 denotes a focal length of the first lens; R5 denotes a curvature radius of an object side surface of the third lens; R6 denotes a curvature radius of an image side surface of the third lens; d8 denotes an on-axis distance from an image side surface of the fourth lens to an object side surface of the fifth lens; and d10 denotes an on-axis distance from an image side surface of the fifth lens to an object side surface of the sixth lens. The camera optical lens can achieve good optical performance while satisfying design requirements for ultra-thin, wide-angle lenses having large apertures.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: November 7, 2023
    Assignee: AAC Optics (Changzhou) Co., Ltd.
    Inventor: Shujian Ding
  • Patent number: 11808625
    Abstract: The present application provides an ambient light sensor and an electronic device, which may improve detection accuracy and detection performance of the ambient light sensor. The ambient light sensor includes: a light filtering unit array including a plurality of light filtering units, the plurality of light filtering units including a color light filtering unit, a white light filtering unit and a transparent light filtering unit, the white light filtering unit being configured to pass a visible light signal and block an infrared light signal, and the transparent light filtering unit being configured to pass the visible light signal and the infrared light signal; a pixel unit array including a plurality of pixel units, the plurality of pixel units being configured to receive a light signal after the ambient light passes through the plurality of light filtering units for an ambient light detection.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: November 7, 2023
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventor: Songjin Zhong
  • Patent number: 11810776
    Abstract: A semiconductor device includes a lower structure, a stack structure on the lower structure and extending from a memory cell region into a connection region, gate contact plugs on the stack structure in the connection region, and a memory vertical structure through the stack structure in the memory cell region, wherein the stack structure includes interlayer insulating layers and horizontal layers alternately stacked, wherein, in the connection region, the stack structure includes a staircase region and a flat region, wherein the staircase region includes lowered pads, wherein the flat region includes a flat pad region, a flat edge region, and a flat dummy region between the flat pad region and the flat edge region, and wherein the gate contact plugs include first gate contact plugs on the pads, flat contact plugs on the flat pad region, and a flat edge contact plug on the flat edge region.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: November 7, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungjun Shin, Siwan Kim, Bonghyun Choi
  • Patent number: 11812547
    Abstract: A memory module including: a first printed circuit board; a first socket and a second socket; and a daisy chain pattern formed in a first region of the first printed circuit board and connected to the first socket and the second socket, wherein an electrical signal on the daisy chain pattern is transferred to a host device when the first socket and the second socket are connected to the host device.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: November 7, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dongyoon Seo, Sangkeun Kwak, Dohyung Kim, Kyeongseon Park, Hwanwook Park, Wonseop Lee, Daae Heo
  • Patent number: 11811240
    Abstract: An apparatus includes a receiver coil configured to be magnetically coupled to a transmitter coil, and a rectifier circuit coupled to two terminals of the receiver coil, wherein in response to a high system gain of the apparatus, the rectifier circuit is configured as a half-bridge rectifier, and in response to a low system gain of the apparatus, the rectifier circuit is configured as a full-bridge rectifier.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: November 7, 2023
    Assignee: Nuvolta Technologies (Hefei) Co., Ltd.
    Inventors: Kaiyong Cui, Zhengyu Li, Zeng Li, Zhijun Luo
  • Patent number: 11811580
    Abstract: This application provides an encoding method. The encoding method includes: first, splitting obtained to-be-encoded data into phase data and amplitude data according to a preset rule; then, obtaining a constellation diagram corresponding to the to-be-encoded data, where the constellation diagram includes a plurality of constellation points, the plurality of constellation points include a constellation point with an amplitude value of 0, each constellation point has a corresponding probability value, and the probability value indicates an occurrence probability of the corresponding constellation point; then, performing probabilistic constellation shaping encoding on the amplitude data based on the constellation diagram and the probability value corresponding to each constellation point, to obtain at least one group of symbol sequences; and then combining the at least one group of symbol sequences and the phase data, and then performing encoding, to obtain output data.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: November 7, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Hong Yi, Juan Zhang
  • Patent number: 11807193
    Abstract: A module support system for a vehicle including exterior paneling defining an interior and exterior of the vehicle, and a frame disposed in the interior of the vehicle, the module support system including a first casting mounted on the frame, where the first casting extends outward from the frame, through the exterior paneling, to the exterior of the vehicle such that the first casting includes an interior portion disposed within the interior of the vehicle and mounted on the frame, and an exterior portion extending outward from the exterior of the vehicle. The module support system includes a first electronic device supported on the exterior portion of the first casting, and a cover fixed with the exterior portion of the first casting such that the cover is disposed over the first electronic device and the exterior portion of the first casting with respect to an external environment.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: November 7, 2023
    Assignee: Honda Motor Co., Ltd.
    Inventors: Taiga Marukawa, Gilberto Larrache-Irizarry, Douglas M. Dafler, Patrick J. Ellison, Kosaku Tomozawa, Keiichiro Tsuji, Anthony John Leanza, Takashi Nakano
  • Patent number: 11808949
    Abstract: The present invention provides a lens driving device, a camera and an electronic apparatus with a small size and an excellent effect in hand vibration correction. The lens driving device includes a case having an accommodation space, in which a lens module is provided. The lens module includes a lens, a lens holder receiving the lens, a support frame for freely rotating the lens holder in a direction orthogonal to an optical axis direction, support members, an electromagnetic driving device, and a base for fixing a circuit board; the electromagnetic driving device is arranged on the lens holder and the base for fixing the circuit board, and is provided adjacent to a level of a center of gravity of the lens module; and the lens module have different movement axes in a plane and is rotatable freely relative to the base for fixing the circuit board.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: November 7, 2023
    Assignee: Changzhou Raytech Optronics Co., Ltd.
    Inventors: Ching-Chung Chiu, Kazuo Shikama
  • Patent number: 11810948
    Abstract: An embodiment includes a device having nanostructures on a substrate, the nanostructures including a channel region. The device also includes a gate dielectric layer wrapping around each of the nanostructures. The device also includes a first work function tuning layer on the gate dielectric layer, the first work function tuning layer including a first n-type work function metal, aluminum, and carbon, the first n-type work function metal having a work function value less than titanium. The device also includes a glue layer on the first work function tuning layer. The device also includes and a fill layer on the glue layer.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: November 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsin-Yi Lee, Cheng-Lung Hung, Chi On Chui
  • Patent number: 11809429
    Abstract: Provided are a method for processing model parameters, and an apparatus. The method comprises: a model parameter set to be sharded is obtained, wherein the model parameter set comprises a multi-dimensional array corresponding to a feature embedding; attribute information for a storage system used for storing the model parameter set to be sharded is obtained, wherein the storage system used for storing the model parameter set to be sharded differs from a system on which a model corresponding to the model parameter set to be sharded is located when operating; the model parameter set to be sharded is stored in the storage system according to the attribute information.
    Type: Grant
    Filed: August 12, 2022
    Date of Patent: November 7, 2023
    Assignee: BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
    Inventors: Cheng Chen, Peng Zhao, Di Wu, Junyuan Xie, Chenliaohui Fang, Longyijia Li, Long Huang, Liangchao Wu, Long Chang, Lizhe Zhang, Yixiang Chen, Xiaobing Liu
  • Patent number: 11812191
    Abstract: A display system includes a conversion apparatus converting video luminance including a luminance value in a first luminance range and a display apparatus connected thereto and displaying the video. The conversion apparatus includes a first acquisition unit, a first luminance converter, a second luminance converter, a quantization converter, and an output unit outputting a third luminance signal to the display apparatus.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: November 7, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kengo Terada, Masayuki Kozuka, Takahiro Nishi, Tadamasa Toma
  • Patent number: 11807300
    Abstract: A cross member structure of a vehicle body includes a floor panel (2) provided below a vehicle interior in the vehicle body (10); side sills (3) that are provided on both sides of the floor panel (2) in a vehicle width direction and extend in a front-rear direction of the vehicle body (10); a cross member (4) that extends in the vehicle width direction and connects the side sills (3) to each other; and a reinforcement (5) that is provided between the cross member (4) and the floor panel (2) and extends in the vehicle width direction, wherein the cross member (4) includes a curved portion (41) that is curved to at least one side in a vertical direction of the vehicle body (10) outward from the reinforcement (5) in the vehicle width direction.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: November 7, 2023
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Tomoya Takeda
  • Patent number: 11810967
    Abstract: A semiconductor device and method for making the semiconductor device comprising a flash memory cell is provided. In accordance with some embodiments, the method includes: patterning a first gate material layer and a gate insulating film over a substrate, the first gate material layer comprising a first gate material, the gate insulating film disposed on the first gate material layer; forming a second gate material layer over the substrate, the gate insulating film, and side walls of the first gate material layer, the second gate material layer comprising a second gate material; etching the second gate material layer to expose the substrate and the gate insulating film and provide a portion of the second gate material layer along each of the side walls of the first gate material layer; and etching the gate insulating film and the first gate material layer so as to form a plurality of gate structures.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: November 7, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Hung Lin, Chun-Chieh Mo, Shih-Chi Kuo
  • Patent number: 11810917
    Abstract: Methods of performing backside etching processes on source/drain regions and gate structures of semiconductor devices and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first transistor structure; a first interconnect structure on a front-side of the first transistor structure; and a second interconnect structure on a backside of the first transistor structure, the second interconnect structure including a first dielectric layer on the backside of the first transistor structure; a contact extending through the first dielectric layer to a source/drain region of the first transistor structure; and first spacers along sidewalls of the contact between the contact and the first dielectric layer, sidewalls of the first spacers facing the first dielectric layer being aligned with sidewalls of the source/drain region of the first transistor structure.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: November 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Hsun Chiu, Ching-Wei Tsai, Yu-Xuan Huang, Cheng-Chi Chuang, Shang-Wen Chang
  • Patent number: 11812517
    Abstract: A UE in a wireless communication system supporting a shared spectrum channel access is provided. The method comprises: determining a set of DSCH transmission windows based on a window periodicity, a window duration, and a window offset; determining a first set of SS/PBCH blocks within a DSCH transmission window of the set of DSCH transmission windows, wherein the first set of SS/PBCH blocks is QCLed; determining a second set of SS/PBCH blocks across at least two DSCH transmission windows being different DSCH windows of the set of DSCH transmission windows, wherein the second set of SS/PBCH blocks is QCLed; and receiving at least one SS/PBCH block that is located in the first set of SS/PBCH blocks or the second set of SS/PBCH blocks based on QCL information of the first set of SS/PBCH blocks or the second set of SS/PBCH blocks within the DSCH transmission window.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: November 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hongbo Si, Yingzhe Li
  • Patent number: 11808677
    Abstract: According to an aspect of the present disclosure, there is provided a polymerase chain reaction (PCR) patch which is provided as a gel type having a net-like structure forming micro-cavities, wherein at least a part of a plurality of reagents used in a PCR are contained in the micro-cavities, and when the patch contacts with an external region, the reagents contained in the micro-cavities move to at least a portion of the external region, and a PCR of a target DNA included in a sample located in the external region is performed.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: November 7, 2023
    Assignee: NOUL CO., LTD.
    Inventors: Dong Young Lee, Chan Yang Lim, Kyung Hwan Kim
  • Patent number: D1003825
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: November 7, 2023
    Assignee: Shenzhen R-TAX technology CO., LTD.
    Inventor: Chunhua Jiang
  • Patent number: D1003889
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: November 7, 2023
    Assignee: HANGZHOU CHIPJET TECHNOLOGY CO., LTD.
    Inventors: Xiaogai Peng, Xiaojing Ma