Patents Assigned to CO
  • Patent number: 12323034
    Abstract: An energy storage flywheel includes a housing; a flywheel rotor arranged in the housing and connected, at an upper end, to a self-bearing motor; a bearing rotor fitted over a lower end of the flywheel rotor and provided, at a lower end, with an annular rotor magnetic steel; and a bearing stator a arranged below the bearing rotor and provided with a cavity which opens towards the bearing rotor, in which the lower end of the bearing rotor is fitted, and at a circumferential surface of which is provided with an annular stator magnetic steel. At least part of the annular stator magnetic steel is opposite to and below the annular rotor magnetic steel in an up-and-down direction and is opposite to the annular rotor magnetic steel in a radial direction of the bearing rotor; and the annular stator magnetic steel and the annular rotor magnetic steel repel each other.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: June 3, 2025
    Assignee: HUACHI KINETIC ENERGY (BEIJING) TECHNOLOGY CO., LTD
    Inventors: Zhiqiang Wang, Sen Su
  • Patent number: 12323062
    Abstract: A multi-phase switching regulator and a switching regulating method using the multi-phase switching regulator employ an interleaving circuit. The multi-phase switching regulator includes: a first regulating circuit configured to receive an input voltage and generate a first sub-output voltage with a first phase by transforming the input voltage in response to a first set signal; a second regulating circuit configured to receive the input voltage and generate a second sub-output voltage with a second phase by transforming the input voltage in response to a second set signal; and the interleaving circuit configured to repeatedly and sequentially generate the first set signal and the second set signal by comparing a reference voltage with an output voltage generated based on the first sub-output voltage and the second sub-output voltage.
    Type: Grant
    Filed: April 6, 2023
    Date of Patent: June 3, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun-Kyu Lee, Nguyen Huyhieu, Dong-Jin Keum, Je-Hyung Yoon, Hee-Seok Han
  • Patent number: 12323845
    Abstract: This application discloses a processing method of an abnormally behaving unmanned aerial vehicle, a network element, a system, and a storage medium, to detect a data packet for transmitting non-command and control (non-C2) data. According to the method, an SMF network element provides a first rule for a UPF network element, where the first rule indicates the UPF network element to detect, from a target transmission data packet, the data packet for transmitting the non-C2 data, and the target transmission data packet is a data packet between the UAV and the UAVC; the SMF network element receives a first session report sent by the UPF network element; and the SMF network element sends an abnormal traffic report to the first network element based on the first session report.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: June 3, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chengchen Zhang, Wenfu Wu, Qianghua Zhu
  • Patent number: 12323881
    Abstract: A device positioning method includes a first electronic device sending, at each of a first position and a second position, a BLUETOOTH positioning signal to a second electronic device in response to a detected shake operation performed on the first electronic device. The first electronic device receives first response information sent by the second electronic device. The first electronic device determines first position information of the second electronic device based on the first response information. The first electronic device displays a second interface, and the second interface includes the first position information and the identifier of the second electronic device.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: June 3, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jianye Yang, Penghui Chen
  • Patent number: 12323433
    Abstract: According to an embodiment, an electronic device may include a communication circuit and at least one processor operatively connected to the communication circuit, and the at least one processor may be configured to connect, via the communication circuit, a communication with a first external electronic device, receive, from the first external electronic device via the communication circuit, a first packet requesting generation of a temporary identity resolving key (IRK) of the electronic device by a second external electronic device, generate a temporary IRK, set a validity period for the temporary IRK, and transmit, to the first external electronic device via the communication circuit, a second packet including the temporary IRK and the validity period for the temporary IRK.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: June 3, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gyujin Lee, Suhyun Kim, Yunsik Bae
  • Patent number: 12323476
    Abstract: A smart conference room system is provided. The smart conference room system includes an intelligent conference interactive panel including one or more processors configured to convert user input into a conference information, a signage, and a memory configured to store the conference information. The intelligent conference interactive panel is configured to transmit conference information to one or more terminal devices. The one or more terminal devices are configured to perform a controllable operation based on the conference information transmitted to the one or more terminal devices. The intelligent conference interactive panel is further configured to receive a status check signal reminding a user of a conference room that a scheduled conference period of time is expired or about to expire.
    Type: Grant
    Filed: March 6, 2024
    Date of Patent: June 3, 2025
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Xiangxiang Zou, Yangyang Zhang, Longyu Wang, Hailong Zhang
  • Patent number: 12324228
    Abstract: An integrated circuit is provided, including a first conductive pattern, at least one first conductive segment, and a first via. The first conductive pattern is disposed in a first layer and configured as a terminal of an inverter. The at least one first conductive segment is disposed in a second layer above the first layer and configured to transmit an output signal output from the inverter. The first via contacts the first conductive pattern and the at least one first conductive segment to transmit the output signal. An area, contacting the first conductive pattern, of the first via is smaller than an area, contacting the at least one first conductive segment, of the first via.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: June 3, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Chia Lai, Shang-Wei Fang, Meng-Hung Shen, Jiann-Tyng Tzeng, Ting-Wei Chiang, Jung-Chan Yang, Stefan Rusu
  • Patent number: 12324233
    Abstract: A semiconductor device includes first and second active patterns disposed on a substrate, a field insulating film disposed between the first and second active patterns, a first gate structure intersecting the first active pattern, and a second gate structure intersecting the second active pattern, in which the first gate structure includes a first gate insulating film on the first active pattern, a first upper insertion film on the first gate insulating film, and a first upper conductive film on the first upper insertion film, and the second gate structure includes a second gate insulating film on the second active pattern, a second upper insertion film on the second gate insulating film, and a second upper conductive film on the second upper insertion film. Each of the first and second upper insertion films may include an aluminum nitride film. Each of the first and second upper conductive films may include aluminum.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: June 3, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Su Young Bae, Jong Ho Park, Dong Soo Lee, Wan Don Kim
  • Patent number: 12324271
    Abstract: A method of aligning light emitting elements includes applying a ground voltage to a first electrode and applying a first AC voltage to a second electrode spaced apart from the first electrode; and applying a ground voltage to the first electrode and applying a second AC voltage to the second electrode, wherein the first AC voltage has an asymmetric waveform.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: June 3, 2025
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jong Hyuk Kang, Won Ho Lee, Hyun Deok Im, Jin Oh Kwag, Hyun Min Cho, Won Kyu Kim, Keun Kyu Song
  • Patent number: 12324280
    Abstract: An embodiment provides a display device including: a substrate; a first electrode and a second electrode spaced from each other on the substrate; and a first light emitting element and a second light emitting element between the first electrode and the second electrode, wherein the first light emitting element and the second light emitting element are electrically insulated from each other, and the first light emitting element and the second light emitting element have different lengths.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: June 3, 2025
    Assignee: Samsung Display Co., Ltd.
    Inventor: Geun Tak Kim
  • Patent number: 12324286
    Abstract: A light-emitting device includes a lead frame, a light-emitting diode (LED) chip, and an encapsulant. The LED chip is disposed on the lead frame, and includes a substrate, a semiconductor light-emitting unit disposed on a surface of the substrate, and a first electrode and a second electrode, which are disposed on the surface of the substrate, and which are located outwardly of the semiconductor light-emitting unit. The first and second electrodes are electrically connected to a lower surface of the semiconductor light-emitting unit, and are respectively connected to a first wiring bonding region and a second wiring bonding region on the lead frame. The encapsulant encapsulates the LED chip.
    Type: Grant
    Filed: April 1, 2024
    Date of Patent: June 3, 2025
    Assignee: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD
    Inventors: Chen-ke Hsu, Changchin Yu, Zhaowu Huang, Junpeng Shi, Weng-Tack Wong
  • Patent number: 12324288
    Abstract: The present invention relates to a display panel, a printing device, and a method of manufacturing the display panel. In the present invention, the width of the first conductor and the second conductor can be increased by matching the printing device with the display panel, and the risk of the open circuit between the first conductor and the first bonding terminal and the open circuit between the second conductor and the second bonding terminal is reduced. The first conductor and the second conductor of the present invention are not on the same plane, so that the risk of short circuit between the first conductor and the second conductor can be reduced.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: June 3, 2025
    Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Hongzhao Deng
  • Patent number: 12322596
    Abstract: Methods for thermal treatment on a semiconductor device is disclosed. One method includes obtaining a pattern of a treatment area having amorphous silicon, aligning a laser beam with the treatment area, the laser beam in a focused laser spot having a spot area equal to or greater than the treatment area, and performing a laser anneal on the treatment area by emitting the laser beam towards the treatment area for a treatment period.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: June 3, 2025
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Kun Zhang, Lei Liu, Yuancheng Yang, Wenxi Zhou, Zhiliang Xia
  • Patent number: 12322598
    Abstract: A method of processing a substrate includes mounting a substrate on a concave mounting surface of a mounting table and deforming a surface of the substrate into a concave shape; detecting, by a height sensor, a height of the surface of the substrate in a vertical direction; determining positions of a plurality of first focus points based on height data of the surface of the substrate, detected by the height sensor; and forming a first modification layer in the substrate by irradiating the plurality of first focus points with a laser beam.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: June 3, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Hwayoung Lee
  • Patent number: 12322608
    Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: June 3, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ying-Hao Wang, Chien-Lung Chen, Chien-Chi Tzeng, Meng-Fu Shih, Hu-Wei Lin
  • Patent number: 12322614
    Abstract: Proposed is a wafer expander for uniformly expanding gaps between dies, and a die supplying module and die bonding equipment including the same. The wafer expander, for supporting a dicing tape to which a plurality of dies are attached and for expanding gaps between the plurality of dies, includes an expander ring detachably coupled to a wafer ring that fixes an edge of the dicing tape, and configured to ascend and descend, and a base ring supporting a bottom side of the dicing tape, and at least a portion thereof is configured to ascend and descend.
    Type: Grant
    Filed: May 22, 2022
    Date of Patent: June 3, 2025
    Assignee: SEMES CO., LTD.
    Inventors: Do Youn Lim, Kuk Saeng Kim, Wan Hee Jeong
  • Patent number: 12321435
    Abstract: The disclosure pertains to a biometric recognition method, the method comprising: receiving biometric data; performing a random transformation of low-bit data in received biometric data; randomly selecting one or more filtering algorithms to pre-process randomly transformed biometric data; and performing identity verification based on pre-processed biometric data.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: June 3, 2025
    Assignee: CHINA UNIONPAY CO., LTD.
    Inventors: Zhijun Fei, Xuetao Qiu, Tao Tang, Wenji Xing, Pengfei Gao, Yanming Yang
  • Patent number: 12319559
    Abstract: A liquid pump with adjustable length and a feed tank are provided. The liquid pump includes a tube component, a pump body, a sealing ring, and a fixing piece. The tube component includes a first tube and a second tube, the first tube and the second tube are sleeved with each other, the first tube is slidable relative to the second tube. The pump body is mounted in a first end of the first tube away from the second tube. The sealing ring is hermetically connected between the first tube and the second tube. The fixing piece is sleeved on the first tube and the second tube. The fixing piece is configured to fix the first tube and the second tube. A length of the tube component is flexibly adjusted to match tanks of different depths, while taking into account sealing and stability.
    Type: Grant
    Filed: January 28, 2025
    Date of Patent: June 3, 2025
    Assignee: ZHONGSHAN PEILI TECHNOLOGY CO., LTD.
    Inventor: Chunlai Lai
  • Patent number: 12319565
    Abstract: The disclosed invention is a MEMS environmental sensor and preparation method thereof. A transfer cavity is produced in the middle of a transfer substrate of a MEMS environmental sensor, and a transfer medium is located inside the transfer cavity. The surface area of an input port is larger than the surface area of an output port. An elastic transfer membrane is provided on the surface of the input port, and an elastic pressure membrane is provided on the surface of the output port. A load bearing cavity is provided in a load bearing substrate, a magnetic sensing element is positioned inside the load bearing cavity, and the load bearing cavity partially overlaps with the output port. The surface area of the input port of the transfer cavity is larger than the surface area of the output port, and on the basis of Pascal's principle, differences in the volume of the transmission cavity are used to transform a small displacement in a region of large volume into a large displacement in a region of small volume.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: June 3, 2025
    Assignee: MultiDimension Technology Co., Ltd.
    Inventors: Insik Jin, Bin Qi, Songsheng Xue
  • Patent number: 12319609
    Abstract: A glass material with low refractive index and radiation resistance, method for preparing the same, and applications thereof. The glass material consists of the following components by mole percent: 60-80% SiO2, 2-10% B2O3, 0.1-1% CeO2, 5-10% Na2O, 2-10% K2O, 1-8% Al2O3, 0-2% CaF2, 0-1% As2O3, and 1-5% alkaline earth metal oxides, wherein the alkaline earth metal oxides are selected from at least one of BaO, SrO, CaO, and MgO. The glass material has a refractive index of ?1.47, a glass transition temperature of ?550° C., a yield point temperature of 645° C., a softening point temperature of ?748° C., and a coefficient of thermal expansion of (82-87)×10?7/° C. After exposure to a 4700 Gy dose of X-ray radiation, the transmittance decreases by ?2%. The glass material can be used as cladding glass material for the preparation of optical glass fibers and fiber panels, capable of meeting the requirements for radiation environment applications.
    Type: Grant
    Filed: May 30, 2023
    Date of Patent: June 3, 2025
    Assignee: CNBM PHOTONICS TECHNOLOGY CO., LTD.
    Inventors: Shengyun Yang, Zhenbo Cao, Meilun Zhang, Jinsheng Jia, Yang Zhang, Jingming Zheng, You Zhou, Zijin Li, Haifeng Lv, Sheng Hong