Abstract: A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

Abstract: A structure of vehicle electric equipment including a restriction member restricting removal of a bolt for fixing a cover. The restriction member includes first and second portions. The first portion is disposed at a position overlapping with at least a part of a distal end of a connector of an electric cable when seen from an attachment/detachment direction and between the distal end and a portion of the housing opposed to the distal end in the attachment/detachment direction. The second portion is positioned on an axial extension of the bolt fixing the cover. Sum of a gap between the bolt fixing the cover and the second portion and a distance in the attachment/detachment direction between the distal end of the connector in a complete fitting state and the first portion is smaller than a length from an opening of the screw hole to a tip of the bolt.

Abstract: An estimation device includes a recognition unit configured to recognize a surrounding environment of a moving object in recognition regions, and an estimation unit configured to estimate a risk for the moving object on the basis of a recognition result from the recognition unit, in which the recognition unit sets a priority region on which a recognition process is preferentially performed among the recognition regions, according to a state of the surrounding environment of the moving object, and sets, as the priority region, a region overlapping a region including at least a part of at least one crosswalk that is present in a vicinity of an intersection region in which a first road on which the moving object is located intersects a second road present in an advancing direction of the moving object.

Abstract: A handling equipment for a placement shelf of display panel is provided. The handling equipment includes a rack, a rotatable driving wheel and a cleansing device. The cleansing device is configured to cleanse the driving wheel. The driving wheel and the cleansing device both are disposed on the rack. The cleansing device contacts with the driving wheel. The driving wheel is configured to contact a bottom frame of the placement shelf of display panel. The driving wheel is disposed with a cleaning layer on the radial periphery of the driving wheel.

Abstract: Disclosed is an automatic die cleaning device with reusable cleaning fluid. The automatic die cleaning device includes a robot, a cleaning fluid cyclic-spraying system and a die overturning mechanism. The automatic die cleaning device can spray the cleaning fluid to a die to clean oil stains off the surface of the wheel die, thus realizing the function of automatically cleaning the oil stains off the surface of the die; and the automatic die cleaning device also has the function of reusing the cleaning fluid, thereby saving the cleaning fluid and reducing the influence on the environment. The cleaned die surface is smooth, and the effect is ideal. The automatic die cleaning device reduces the labor intensity, meets the requirement of high-efficiency production, and improves the production efficiency.

Abstract: A fan includes a support, a motor mounted at the support and including a first rotation shaft, a first blade mounted at one end of the first rotation shaft, a transmission mechanism mounted at the support and connected to another end of the first rotation shaft, and a second blade. The transmission mechanism includes a second rotation shaft. A rotation direction of the second rotation shaft is opposite to a rotation direction of the first rotation shaft. The second blade is mounted at the second rotation shaft. A tilt direction of the first blade is opposite to a tilt direction of the second blade.

Abstract: A light-emitting structure, a backlight module, a display module, and a display device are provided. The light-emitting structure includes a circuit substrate, including a first surface and a second surface sequentially arranged along a light-exiting direction of the light-emitting structure. The circuit substrate also includes a light-transparent substrate and a wiring structure located on a side of the light-transparent substrate in a thickness direction. The light-emitting structure also includes a plurality of light-emitting elements, arranged in an array on one of the first surface or the second surface of the circuit substrate. The plurality of the light-emitting elements is electrically connected to the wiring structure. The light-emitting structure also includes a heat sink, located on a side of the first surface of the circuit substrate. The heat sink is configured for dissipating heat generated by the plurality of the light-emitting elements.

Abstract: A safety rack regulating device for nailing guns comprises a regulating base, a guide slot located in the left part of regulating base, and a safety rack located in the guide slot. The left end of safety rack is extended out of the regulating base and provided with a safety head. A square groove is located in the left part of the regulating base. A clamping cap is located in the regulating base, the clamping cap seals the opening of square groove. The enclosure between the clamping cap and inner wall of regulating base forms a guide hole. A suited adjusting bolt is located in the guide hole. A transverse punch hole is located in the center of the adjusting bolt. A regulation hole corresponding to the position of adjusting bolt is located in the outer wall of the regulating base.

Abstract: A capacitor component includes a lamination portion in which first and second internal electrodes are disposed to face each other in a first direction and separated from each other by a dielectric layer, and a body comprising the lamination portion and first and second connection portions disposed on both sides of the lamination portion in a second direction, perpendicular to the first direction, and connected to the first and second internal electrodes. The first and second connection portions each include a metal layer including nickel and disposed on the lamination portion and a ceramic layer disposed on the metal layer, and an average thickness of each of the first and second internal electrodes is 0.4 ?m or less.

Abstract: Disclosed is a semiconductor package comprising a first semiconductor chip, a second semiconductor chip on a first surface of the first semiconductor chip, and a plurality of conductive pillars on the first surface of the first semiconductor chip and adjacent to at least one side of the second semiconductor chip. The first semiconductor chip includes a first circuit layer adjacent to the first surface of the first semiconductor chip. The second semiconductor chip and the plurality of conductive pillars are connected to the first surface of the first semiconductor chip.

Abstract: A core material has a core; a solder layer provided outside the core and being a solder alloy containing Sn and at least any one element of Ag, Cu, Sb, Ni, Co, Ge, Ga, Fe, Al, In, Cd, Zn, Pb, Au, P, S, Si, Ti, Mg, Pd, and Pt; and a Sn layer provided outside the solder layer. The solder layer has a thickness of 1 ?m or more on one side. The Sn layer has a thickness of 0.1 ?m or more on one side. A thickness of the Sn layer is 0.215% or more and 36% or less of the thickness of the solder layer.

Abstract: The semiconductor device includes a first conductor and a second conductor; a first insulator to a third insulator; and a first oxide to a third oxide. The first conductor is disposed to be exposed from a top surface of the first insulator. The first oxide is disposed over the first insulator and the first conductor. A first opening reaching the first conductor is provided in the first oxide. The second oxide is disposed over the first oxide. The second oxide comprises a first region, a second region, and a third region positioned between the first region and the second region. The third oxide is disposed over the second oxide. The second insulator is disposed over the third oxide. The second conductor is disposed over the second insulator. The third insulator is disposed to cover the first region and the second region and to be in contact with the top surface of the first insulator.

Abstract: A battery pack includes: a plurality of secondary battery cells connected to each other in series and/or in parallel; and a housing case that includes a plurality of battery housing spaces for housing the plurality of secondary battery cells. A number of the plurality of battery housing spaces is larger than a number of the plurality of secondary battery cells. A heat absorber is disposed in the battery housing space where the secondary battery cell is not housed.

Abstract: A projector of the present invention includes a light source unit including a semiconductor light emitting element and a color wheel and emitting lights in first and second wavelength ranges in time division, a display device receiving light source light to form image light, a projection optical system for projecting the image light onto a projection target, a delay time setting module for shifting a start timing of a color mixing period when the lights in the first and second wavelength ranges are emitted in a mixed fashion in a spoke period of the color wheel during which emissions of the lights in the first and second wavelength ranges are switched over based on an index indicating a brightness of light from the light source unit, and a light source driving module for driving the light source unit based on a setting set by the delay time setting module.

Abstract: A flow channel assembly (200) of a fluid micro-injection device has a fluid seat (210), a nozzle mounting plate (240), a nozzle (220), a nozzle platen (250) and a fluid supply joint (230). The nozzle (220) is connected to the fluid seat (210) by the nozzle mounting plate (240). The nozzle platen (250) is connected with the nozzle mounting plate (240) to secure the nozzle (220). The fluid supply joint (230) and the fluid seat (210) are connected to control the fluid flowing to the nozzle (220).