Abstract: An electric commutator (20) with multiple switch ways comprising a horizontal upper panel (24) with an upper face (24s) that can be contacted by a pointing element, a supporting frame (22) and means (26) for locating the point of contact of the pointing element on the horizontal upper face (24s) of the upper panel (24) that comprise a plurality of electric switches (28) on the supporting frame (22) that are capable of being actuated selectively by the upper panel (24). The switches (28) are distributed on the supporting frame (22) so as to divide the horizontal upper face (24s) of the upper panel (24) into a plurality number of contact zones (44), the number of which contact zones (44) is greater than the number of switches (28).

Abstract: An electrical switch may include a support bearing contacts, at least one elastically deformable release element for establishing an electrical connection between two contacts, an actuation pusher that is configured to be movable relative to the support along an overall horizontal path in the plane of the plate bearing electronic components and a lever that is configured to be mounted in a hinged manner relative to the support about a horizontal axis and which converts the horizontal actuation force exerted on the pusher into a vertical release force applied to the release element. The lever may be elastically deformable to allow a movement of the pusher beyond the actuation position.

Abstract: An arrangement may include a substrate and an electrical component. The electrical component may include a base made of an insulating material and a plurality of connection terminals. Each connection terminal is connected to a corresponding connection pad of the substrate by means of a spot of solder paste. The arrangement may further include a block interposed between the substrate and the base of the electrical component. The block may be located substantially on the axis of application of a force for actuating the electrical component and may be designed to inhibit deformation of the base. The block may include a spot of solder paste soldered to an associated conducting pad on the substrate.