Abstract: A process for etching the sides of a trace remove the feet which extend laterally out from the sides and over a circuit board substrate adjacent the trace.
Type:
Grant
Filed:
April 30, 1997
Date of Patent:
May 18, 1999
Assignee:
Coates ASI, Inc.
Inventors:
Michael M. Hatfield, Marshall I. Gurian
Abstract: Apparatus for processing a thin circuit board substrate includes upper and lower input roller assemblies and upper and lower output roller assemblies. A liquid reservoir extends between the input roller assemblies and the output roller assemblies. The thin substrate travels from the input roller assemblies, through the reservoir, and exits the reservoir via the output roller assemblies. The lower input roller assembly includes alternating rollers of different diameter which permit the interleaving of disks with the lower input roller assembly.