Abstract: Silicon-based protective film for adhesive or self-adhesive elements, characterized in that said protective film is based on silicone and has a level of extractible silicone less than or equal to 100 ng/cm2, preferably less than or equal to 50, preferably less than or equal to 20 ng/cm2, and even more preferably less than 10 ng/cm2, the method of production thereof and uses thereof.

Abstract: Silicon-based protective film for adhesive or self-adhesive elements, characterized in that said protective film is based on silicone and has a level of extractible silicone less than or equal to 100 ng/cm2, preferably less than or equal to 50, preferably less than or equal to 20 ng/cm2, and even more preferably less than 10 ng/cm2, the method of production thereof and uses thereof.

Abstract: This unit comprises a housing (50) for receiving an electrode suitable for creating an electrical discharge, and first means (20, 21, 22) for injecting treatment gas, comprising at least one plasma-forming gas, towards the support of the facility. According to the invention, the first injection means comprise an intake member (20) for the treatment gas, a treatment gas injection member (21), opening opposite the support, and an intermediate chamber (22) connecting these two members. This chamber comprises an upstream region (24), the gas passage cross-section of which increases from the inlet (25E, 26E) towards the outlet (25S, 26S) in longitudinal view (XX) and/or transverse view, as well as a downstream region (27), the passage cross-section of which increases from the inlet (28E, 29E) towards the outlet (28S, 29S) in transverse view but decreases in the vicinity of the outlet (28S, 29S) in longitudinal view (XX).

Abstract: This facility comprises a support (1) for the substrate, a pressing roll (2), capable of pressing the substrate against said support, a treatment unit positioned downstream of the pressing roll, with reference to the direction of travel of the substrate, said unit comprising injection means (37) for injecting a treatment gas towards said support and means (8) for transforming the surface of the moving substrate.