Abstract: A method and apparatus for finding an edge contour in an image of an object is provided that is robust against object/background misclassification due to non-uniform illumination across an image, while also being computationally efficient, and avoiding the need to select a classification threshold. The invention can be used to partition an image of a scene into object regions and background regions, or foreground regions and background regions, using edge contours found in the image. The invention is particularly useful for analysis of images of back-lit objects. The edge contour is progressively formed by finding a sequence of one-dimensional edge positions, each one-dimensional edge position being determined by processing a set of pixels arranged along at least one imaginary line.
Abstract: A machine vision system for identifying the locations of bonding pads on an integrated circuit mounted in a lead frame. The system involves locating the bonding pads by searching an image with suitably rotated corner templates. A set of possible candidate bonding pads is created from the location of corner templates found during the search. The set is then scored utilizing matching criteria. The best candidate is selected from the set based upon the candidates' scores. The location of the bonding pad is then generated from the best candidate's corner template locations. The invention can be beneficially applied to locate bonding pads during wire bonding, as well as other machine vision applications.
Type:
Grant
Filed:
October 31, 1995
Date of Patent:
May 26, 1998
Assignee:
Cognex Corp.
Inventors:
Juha Koljonen, David Michael, Yasunari Tosa
Abstract: A machine vision system for identifying the locations of bonding pads on an integrated circuit mounted in a lead frame. The system involves rotating the image of the die to produce an image of the die unrotated with respect to the lead frame (the "counter-rotated image"). The counter-rotated image is searched with corner templates of the bonding pad. A set of possible candidate bonding pads is created from the location of corner templates found during the search. The set is then scored utilizing matching criteria. The best candidate is selected from the set based upon the candidates' scores. The location of the bonding pad is then generated from the best candidate's corner template locations. The invention can be beneficially applied to locate bonding pads during wire bonding, as well as other machine vision applications.
Type:
Grant
Filed:
October 31, 1995
Date of Patent:
May 19, 1998
Assignee:
Cognex Corp.
Inventors:
Juha Koljonen, David Michael, Yasunari Tosa
Abstract: A method and apparatus for identifying an object having an identifying feature includes a two step process for detecting the identifying feature. The process involves locating the feature based upon a first characteristic of the feature and then verifying that feature is the identifying feature based upon a second characteristic of the feature. Preferably, the first step of the process is less discriminating and substantially faster than the second step. This permits the process to be performed rapidly without reducing accuracy.