Abstract: An automated test system for testing singulated electronic components comprises a handler, comprising a plurality of handler pickers and/or spinner pickers, the handler pickers and/or spinner pickers being adapted to each pickup one electronic component, at least one processing station for processing one of the electronic components, a first carrier, a second carrier, and a test unit, for testing singulated electronic components located on a carrier. When the second plurality of electronic components on the second carrier are tested in the test unit while the second plurality of electronic components rest on the second carrier, simultaneously the first carrier is loaded with the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers and/or unloaded from the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers.

Abstract: A contact socket module for use in an automated test equipment (ATE) for testing electronic components (DUTs) being carried by a carrier comprises: a plurality of groups of spring contacts, wherein each spring contact comprises a DUT sided contact tip, a retracting plate being moveable, and a controller controlling the movement of the retracting plate, wherein the retracting plate and the spring contacts act mechanically on each other. In a first position the DUT sided contact tips are adapted to contact to contact portions of the electronic components, and in a second position, the DUT sided contact tips are adapted to release the contact to the contact portions of the electronic components.

Abstract: A test socket for and a method of testing electronic components, in particular high-power semiconductor components comprise: a plurality of contact elements, being adapted to contact to the electronic component; a holder block for holding and arranging the plurality of contact elements, wherein each contact element of the plurality of contact elements comprises at least one conductive surface portion; wherein the holder block comprises a plurality of electrically conductive support sections, for supporting the conductive surface portions of the plurality of contact elements, wherein the plurality of support sections, makes electrical contact to the plurality of conductive surface portions by supporting the conductive surface portions, and wherein the holder block at least partially transmits a test signal.

Abstract: A sound test device for testing a DUT in particular a MEMS microphone, comprises a sound chamber a socket unit and a sound generator unit, wherein the sound generator unit includes a speaker comprising a speaker membrane, an opening, and a reference microphone comprising a microphone membrane wherein the opening is adapted to receive a DUT opening of the DUT and wherein the microphone membrane and the opening are arranged to opposing each other, and the socket unit includes the at least one contact element being adapted to contact to a contact terminal of the DUT, and wherein the sound chamber is limited by the speaker membrane, the microphone membrane, and the opening.

Abstract: A test module for testing microphones comprises an outer chamber being airtight, and a sound chamber comprising an electrical test device for testing the microphones. The sound chamber is located within the outer chamber, and the sound chamber is coupled to the outer chamber with a connection suppressing structure-borne noise between the outer chamber and the sound chamber. A space between the outer chamber and the sound chamber has a gas pressure being lower than an ambient air pressure. A method of testing microphones comprises evacuating the space between the outer chamber and the sound chamber to having a lower gas pressure than an ambient air pressure, and testing the microphone.

Abstract: An automated test system for testing singulated electronic components comprises a handler, comprising a plurality of handler pickers and/or spinner pickers, the handler pickers and/or spinner pickers being adapted to each pickup one electronic component, at least one processing station for processing one of the electronic components, a first carrier, a second carrier, and a test unit, for testing singulated electronic components located on a carrier. When the second plurality of electronic components on the second carrier are tested in the test unit while the second plurality of electronic components rest on the second carrier, simultaneously the first carrier is loaded with the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers and/or unloaded from the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers.

Abstract: An automated test equipment (ATE) for testing semiconductor devices, the test equipment comprises a test handler, a spare part, or a contactor socket, and a semiconductor devices tester, The spare part comprises an electronic component for storing and or processing data regarding the spare part or a portion thereof, The test equipment comprises an operator terminal comprising a display or GUI and a data exchange interface which is connected or connectable to the electronic component within the spare part, for at least displaying data stored therein. The ATE further comprises a data buffer unit for buffering the data, a maintenance planning and control unit for planning and controlling maintenance actions of the test equipment, and a dedicated database residing in a control computer.

Abstract: A contact socket module for use in an automated test equipment (ATE) for testing electronic components (DUTs) being carried by a carrier comprises: a plurality of groups of spring contacts, wherein each spring contact comprises a DUT sided contact tip, a retracting plate being moveable, and a controller controlling the movement of the retracting plate, wherein the retracting plate and the spring contacts act mechanically on each other. In a first position the DUT sided contact tips are adapted to contact to contact portions of the electronic components, and in a second position, the DUT sided contact tips are adapted to release the contact to the contact portions of the electronic components.

Abstract: A test module for testing microphones comprises an outer chamber being airtight, and a sound chamber comprising an electrical test device for testing the microphones. The sound chamber is located within the outer chamber, and the sound chamber is coupled to the outer chamber with a connection suppressing structure-borne noise between the outer chamber and the sound chamber. A space between the outer chamber and the sound chamber has a gas pressure being lower than an ambient air pressure. A method of testing microphones comprises evacuating the space between the outer chamber and the sound chamber to having a lower gas pressure than an ambient air pressure, and testing the microphone.