Abstract: Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.

Abstract: Accelerometer including a seismic mass in a plane and a first capacitor plate and a second capacitor plate arranged parallel to the plane. The seismic mass is arranged in between the first capacitor plate and the second capacitor plate. The first capacitor plate and the second capacitor plate are configured to detect movements of the seismic mass out of the plane. A pillar extending from the first capacitor plate to the second capacitor plate through a cut-out in the seismic mass for stiffening the accelerometer.

Abstract: A method for evaluating and/or compensating the acceleration offset in a combined accelerometer and gyroscope, wherein the evaluation or compensation is based on a quadrature signal delivered by the accelerometer.

Abstract: A vibrating gyroscope includes a proof mass (1); a spring suspension system (5, 6, 7, 8; 9) for suspending the proof mass; an electrical drive mechanism for vibrating the proof mass along a drive axis (x); and electrodes (2, 3) for building together with at least a part of the proof mass (1) a capacitance system for detecting moves of the proof mass along a sense axis (z) perpendicular to the drive axis. The gyroscope is arranged so that quadrature forces generate displacements of the proof mass without substantially displacing the neutral point (10) of the proof mass along the sense axis (z). This may be achieved by tilting the proof mass while keeping its neutral point at a constant position along the sense axis, or by applying a constant electrostatic force.

Abstract: A method for evaluating and/or compensating the acceleration offset in a combined accelerometer and gyroscope, wherein the evaluation or compensation is based on a quadrature signal delivered by the accelerometer.

Abstract: A vibrating gyroscope comprising: a proof mass (1); a spring suspension system (5, 6, 7, 8; 9) for suspending the proof mass; an electrical drive mechanism for vibrating the proof mass along a drive axis (x); electrodes (2, 3) for building together with at least a part of the proof mass (1) a capacitance system for detecting moves of the proof mass along a sense axis (z) perpendicular to the drive axis. The gyroscope is arranged so that quadrature forces generate displacements of the proof mass without substantially displacing the neutral point (10) of the proof mass along the sense axis (z). This may be achieved by tilting the proof mass while keeping its neutral point at a constant position along the sense axis, or by applying a constant electrostatic force.

Abstract: Microelectromechanical system (MEMS) comprising: an active part (5) comprising an electromechanical device (28), at least one base (6) for fastening said microsystem on a support (8), at least one fastener (21, 21?) fastening said active part (5) to said at least one base (6) and allowing a displacement of said active part (5) relatively to said at least one base (6) along an axis (Z) more or less perpendicular to the plane of said support (8) when said microsystem is fastened onto said support (8), bumper elements (27, 27?, 37?) for limiting the amplitude of the displacements of said active part (5) relatively to said at least one base (6) along said perpendicular axis (Z). The active part (5) being capable of moving relatively to the base (6) to which it is fastened, it is isolated from any mechanical constraint that could be sustained by the base (6), in particular torsion or flexion due to it being fastened onto a support (8).

Abstract: Microelectromechanical system (MEMS) comprising: an active part (5) comprising an electromechanical device (28), at least one base (6) for fastening said microsystem on a support (8), at least one fastener (21, 21?) fastening said active part (5) to said at least one base (6) and allowing a displacement of said active part (5) relatively to said at least one base (6) along an axis (Z) more or less perpendicular to the plane of said support (8) when said microsystem is fastened onto said support (8), bumper elements (27, 27?, 37?) for limiting the amplitude of the displacements of said active part (5) relatively to said at least one base (6) along said perpendicular axis (Z). The active part (5) being capable of moving relatively to the base (6) to which it is fastened, it is isolated from any mechanical constraint that could be sustained by the base (6), in particular torsion or flexion due to it being fastened onto a support (8).