Abstract: A process for highspeed branding of an intricate pattern, usually a wood grain pattern, into materials such as particle board, hard board or various lumbers having poor grain characteristics is disclosed. The material to be branded is passed under a heated rotary die having the desired pattern thereon to emboss by heat shrinking and to char the pattern into the material; and the improvement of the process of the present invention, which effects an increased die life, is comprised of maintaining the die at about a temperature between about 800.degree. and about 900.degree. F. This temperature range is high enough to achieve high quality branding and high quantity production, while minimizing degradation of the die pattern from oxidation and contact with the material being branded. The die pattern is preferably relatively deep, in excess of 0.040 inch, and is urged into the material to a depth of about one-half the pattern depth.