Abstract: A method is disclosed for providing labelling of small items through the use of microlabels having colored bar codes with the microlabel being on the order of 1 mm.times.1 mm in overall size. In one embodiment, the label consists of a number of colored lines or bars similar to a black/white bar code, with each bar having a distinct color or hue, the width of the bars being in the 5-120 micron range in terms of width, the bars being either contiguous or separated by a thin bar of distinct color. One method of making ultra thin labels includes cutting or skiving an edge of a layered sheet, with different layers carrying different colors, and with the cut layers having a thickness on the order of 0.1 mm.

Abstract: A method is disclosed for both making microlabels and for using these labels to provide a unique system for identifying an integrated circuit (IC) die on a wafer, in one embodiment, by applying a color bar encoded microlabel, small enough to be placed on the surface of the die, with the microlabel being on the order of 2 mm.times.2 mm in overall size. In one embodiment, the label consists of a number of colored lines or bars similar to a black/white bar code, with each bar having a distinct color or hue, the width of the bars being in the 5-120 micron range in terms of width, the bars being either contiguous or separated by a thin bar of distinct color. The microlabels, whether color bar or black/white coded, are applied preferably at the wafer probing stage of manufacture, wherein each die is labelled with the bar code best expressing the parameters the manufacturer is desirous of using for further processing and/or ultimate sales and/or use.