Abstract: The invention relates to a method for forming walls of micron or submicron cavities, including: the formation of a photolithographic mask on a transparent support (10, 12, 14), the deposition of a resin layer (18) of photosensitive material on the face, a so-called front face, of the support which supports the mask, the insolation of the photosensitive material layer through the rear face (10?) of the support, the development of the photosensitive material for obtaining said walls.

Abstract: A seal including an outer envelope that may be made of PTFE, and an inner core including an air-permeable sack partially filled with a granular fluid. When bearing surfaces that are to be sealed are near one another, the sack is squashed, an upper volume of air escapes to the outside, and grains transmit a substantial contact pressure between lips of the envelope and the bearing surfaces. They may have moved during the squashing movement so as to even out the pressure by redistributing themselves in the sack even if there is a significant lack of flatness between the bearing surfaces.

Abstract: The invention concerns a method for locating at least one fluorophore or at least one absorber in a diffusing medium, using at least one excitation radiation and at least one fluorescence detector (?fluo), comprising: a) for at least one pair (radiation source-detector), at least one excitation by the radiation source, and at least one detection of the fluorescence signal emitted by the fluorophore after this excitation, b) identification of meshing of the volume into mesh elements, c) estimation of the location of the fluorophore or absorber in its diffusing medium, by computing a function (Pm) of at least one of three parameters.

Abstract: An electronic component including at least one chip and/or one support, the chip configured to be transferred onto the support and linked, at a level of at least one connection site of the chip, formed by at least one portion of a layer of the chip, to at least one connection site of the support formed by at least one portion of a layer of the support, by at least one ball, the chip and/or the support including a mechanism for mechanical decoupling of the connection site of the chip and/or of the support with respect to the chip and/or to the support, which mechanism includes at least one cavity made in the layer of the chip and/or of the support, under the connection site of the chip and/or of the support, and at least one trench, made in the layer of the chip and/or of the support, communicating with the cavity.