Abstract: An electromagnetically reflective plate for a miniature antenna device includes: etched conductive elements on a first dielectric substrate layer; an apertured ground plane placed between the first substrate layer and a second dielectric substrate layer; a set of metal through-vias formed in the thickness of the two substrate layers, each including an upper end making contact with one of the conductive elements, a lower end reaching a lower face of the second substrate layer, and passing through the ground plane without electrical contact in one of its apertures. Each conductive element makes contact with a plurality of vias and each via of each conductive element is connectable to another via of a neighboring conductive element using a corresponding electrical connection making contact with the lower end of this via. At least some of the electrical connections include one or more meanders.

Abstract: Use of at least one corrosion-inhibiting additive to reduce the production of hydrogen via corrosion of magnesium metal conditioned in a cement matrix is provided. Also provided is a material for conditioning magnesium metal given such use and its method of preparation.

Abstract: The invention relates to a method for controlling a light-sensitive device comprising a matrix of light-sensitive points arranged into lines and columns. The invention can essentially but not exclusively be used in light-sensitive devices used for detecting X-ray images. The method includes a step (E2) of acquiring an image during which each light-sensitive point can accumulate a charge, and a step (E3) of reading said image. The reading step (E3) comprises a preliminary sub-step (E31) of converting the charges accumulated at the different light-sensitive points into analog signals representative of said charges, and a sub-step (E32) of processing the analog signals in order to obtain a digital image.

Abstract: An electronic component is attached to a product, using a transfer method involving the use of a transfer sheet including a substrate sheet and at least one transfer layer covering a portion of the front surface of the substrate sheet. The transfer method consists in: placing the transfer layer in contact with the product; applying a pressure against the back surface of the substrate sheet; and finally removing the substrate sheet, said at least one transfer layer remaining affixed to the product. In addition, the attachment method includes a step prior to the transfer method, during which at least one electronic assembly including at least one electronic chip attached to at least one wire is positioned between the product and the substrate sheet, such that at least one portion of each assembly is held in place by a transfer layer following the removal of the substrate sheet.