Abstract: Methods and structures for forming uniaxially-strained, nanoscale, semiconductor bars from a biaxially-strained semiconductor layer are described. A spatially-doubled mandrel process may be used to form a mask for patterning dense, narrow trenches through the biaxially-strained semiconductor layer. The resulting slicing of the biaxially-strained layer enhances carrier mobility and can increase device performance.
Type:
Grant
Filed:
July 31, 2014
Date of Patent:
February 2, 2016
Assignees:
STMicroelectronics, Inc., Commissariat A L'Energie Atomique Et Aux Energies Alternives, GlobalFoundries Inc.
Inventors:
Pierre Morin, Maud Vinet, Laurent Grenouillet, Ajey Poovannummoottil Jacob