Abstract: The present invention relates to a power junction device including a substrate of the SiCOI type with a layer of silicon carbide (16) insulated from a solid carrier (12) by a buried layer of insulant (14), and including at least one Schottky contact between a first metal layer (40) and the surface layer of silicon carbide (16), the first metal layer (30) constituting an anode.
Type:
Application
Filed:
March 12, 2003
Publication date:
July 28, 2005
Applicants:
Commissarist A L'Energie Atomique, S.O.I TEC Silicon On Insulator Technologies
Inventors:
Francois Templier, Thierry Billon, Nicolas Daval