Abstract: The main object of the invention is the limiting of corrosion in vapor-phase reflow soldering machines. Liquid chlorine and fluorine are used in the device for soldering in vapor phase. The decomposition of these elements by heat releases ions which, when brought in the presence of water, form hydrofluoric acid and hydrochloric acid. These acids corrode the tank through which the soldering method is used as well as the metallic elements of the soldered components. The device which is the object of the present invention eliminates water from the secondary liquid by isolating the vapors of these liquids from the atmosphere, preventing water from penetrating into the water-removal cartridge and providing for the water-removal process before fresh secondary liquid is brought into use. The invention applies mainly to reflow soldering in vapor phase.