Abstract: A method for the manufacture of foil capacitors with metallized plastic films, said method comprising the following steps:coiling at least one pair of metallized plastic films so as to form the stacked structure of the capacitors;metallizing the lateral faces of the coiled structure in order to create the plates of the capacitors;cutting out the coiled and metallized structure, or parent capacitor, into semi-finished capacitors;putting the semi-finished capacitors and their connection wires through a cleansing flux;soldering the connection wires to the plates of the semi-finished capacitors;wherein the soldering is done by wave soldering and wherein, between said metallization and said cutting, a heat treatment operation designed to give the plastic film the characteristics needed to withstand the wave soldering and a new metallization designed to ensure the mechanical and electrical quality of the connections are carried out successively.

Abstract: A method for the making of an integrated type of LC component comprises the following steps;the coiling of an elongated element made of a metal with valve effect, the ends of which constitute two electrodes;the anodization of the element to form a dielectric layer;impregnation by an electrolyte, andthe positioning of a third electrode in a known way.Application to integrated passive components.

Abstract: The disclosure concerns a metallic tape that has been previously cut out and is designed for the mounting of surface-mounted components (SMC), using chips having two metallizations on two opposite faces. Each component position, demarcated by two transversal slots, comprises two external connections, each extended by a contact element. This contact element is characterized by a curved shape, formed by a surface to be soldered and a tongue so that, after folding, to create a space for the component, the surfaces to be soldered overlap partially, forming a clip for the component. The disclosure is applicable to the fabrication of SMC components.

Abstract: A method of making a flat magnetic structure having coils thereon, said structure including magnetic read/write heads using a flat substrate that has at least one side made of a magnetic material, said method including the steps of:initial machining of the magnetic side of the substrate to form supporting means for conducting wires, which forms said coils, and to demarcate future magnetic poles of said magnetic read/write heads; then depositing, on either side or both sides of the substrate, connecting pins at a rate of two pins per said coil; then positioning the conducting wires on said supporting means to form the coils; then connecting the ends of the conducting wires of each coil to the corresponding connecting pins; then coating the machined magnetic side with an insulating material; and then machining and polishing the coated side until the magnetic poles are exposed.

Abstract: A type I dielectric composition based on neodymium titanate is formed of a mixture comprising 58% to 78% by weight of neodymium titanate (Nd.sub.2 O.sub.3 -3TiO.sub.2), 10 to 21% by weight of lead titanate (PbTiO.sub.3), 5% to 14% by weight of barium titanate (BaTiO.sub.3), 4% to 15% by weight of barium zirconate (BaZrO.sub.3) and 0.2% to 1.2% by weight of yttrium oxide (Y.sub.2 O.sub.3).