Abstract: The invention provides a manufacturing method of a heat dissipation component. A substrate is provided. The substrate has an outer surface. A patterned dry film is formed on the outer surface. The patterned dry film is composed of a plurality of microporous patterns. A thermally conductive layer is formed on a region excluding the microporous patterns on the outer surface. The patterned dry film is removed to form a plurality of micro meshes. The thermally conductive layer surrounds the micro meshes.

Abstract: The invention provides a manufacturing method of a heat dissipation component. A substrate is provided. The substrate has an outer surface. A patterned dry film is formed on the outer surface. The patterned dry film is composed of a plurality of microporous patterns. A thermally conductive layer is formed on a region excluding the microporous patterns on the outer surface. The patterned dry film is removed to form a plurality of micro meshes. The thermally conductive layer surrounds the micro meshes.

Abstract: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.

Abstract: The present invention relates a method for forming heightened solder bumps on a circuit board, which has a surface formed with a plurality of pads and a solder resist thereon and the pads are exposed from the solder resist. The steps of the method mainly are: firstly, applying a first stencil printing and a first reflow process to the circuit board so that a plurality of first solder bumps form on the pads respectively. Then, apply a second stencil printing and a second reflow process to the circuit board so as to have solder paste formed on the first solder bumps and to have the solder paste integrated with the first solder bumps respectively to form the heightened solder bumps on the pads.

Abstract: The present invention relates a printed circuit board having jumper lines, and a method for making the printed circuit board. An isolation layer made of a dielectric material is coated on the line layer of the printed circuit board, and multiple pads are formed in the isolation layer, thereby exposing part of the line layer without covered by the isolation layer. A high conductive material is coated on the isolation layer to connect the multiple pads, thereby forming a planar jumper layer that is connected to the line layer through the circular pads. Thus, the planar jumper layer may be made simultaneously during fabrication of the printed circuit board, without having to perform the wire-bonding work.

Abstract: A method for making holes in a substrate includes steps of cleaning a surface of the substrate and boring the blind holes in the surface of the substrate with laser beams.

Abstract: A method of bonding copper and resin comprising the steps of:a) forming a layer of copper oxide on a surface of copper by oxidation of copper;b) reducing the layer of copper oxide thus formed to metallic copper with a reducing solution with the addition of an alkaline solution and a stabilizer at a controlled temperature under a circulated condition within a controlled period of time to modify its morphology; andc) forming a layer of copper oxide on a surface of the metallic copper by baking; andd) bonding the surface of the copper oxide formed by the baking and a resin together by heat-pressing.

Abstract: A method for producing copper sulfate from waste copper-containing liquid including the steps of recovery of acidic and basic copper-containing liquid, and neutralization of the liquid to form crystalline copper sulfate, wherein the ratio of acidic to basic copper-containing liquid, temperature, pH value and the concentration of copper ion in the resultant solution of each step is being controlled such that the solid copper sulfate is obtained in high yield and purity and will have a larger particle size, and at the same time, the filtrate will contain copper ion in a concentration below 0.3 ppm before being expelled to the surroundings.

Abstract: A method of bonding copper and resin comprising the steps of:(a) forming a layer of copper oxide on the surface of copper by oxidation of copper;(b) reducing the layer of copper oxide thus formed to cuprous oxide with a reducing solution of a controlled concentration and controlled pH at a controlled temperature under a circulated condition within a controlled period of time to modify its morphology; and(c) bonding the surface of the cuprous oxide formed by the reduction and a resin together by heat-pressing.