Patents Assigned to Compeq Manufacturing Company Ltd.
  • Packaging method for a ball grid array integrated circuit without utilizing a base plate
    Patent number: 5830800
    Abstract: A packaging method for a ball grid array (BGA) integrated circuit (IC) without utilizing a base plate as a supporting plate, and therefore reducing the thickness of the packaged BGA IC. In the method, a copper sheet is used as a supporting plate first. After resin is applied to coat a chip implanted on the copper sheet and connecting wires thereof has hardened, the hardened resin is sufficiently firm to support the IC, so the copper sheet can be etched. Accordingly, a base plate is not necessary.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: November 3, 1998
    Assignee: Compeq Manufacturing Company Ltd.
    Inventor: Ting-hao Lin