Patents Assigned to COMPERTUM MICROSYSTEMS INC.
  • Patent number: 11454545
    Abstract: A depth thermal imaging module, including a thermal imager array, which includes a plurality of at least two thermal imagers that capture thermal radiation of a wavelength of a scene from different viewpoints. Each thermal imager includes a thermal imager chip, a lens stack, and a focal plane with focal length f. The thermal imagers are separated by a baseline distance of 2h and depth measurement Z is performed on an object of interest based on Z=2hf/? where ? is the difference in location of the object of interest between its location in the thermal image captured by a first thermal imager and the location of the object of interest in the thermal image captured by a second thermal imager and represents as an offset of the point on the focal plane of the first thermal imager and the second thermal imagers relative to their optical axis.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: September 27, 2022
    Assignee: COMPERTUM MICROSYSTEMS INC.
    Inventor: Francis Piu Man