Patents Assigned to Compositech Ltd.
  • Patent number: 5512224
    Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
    Type: Grant
    Filed: November 1, 1990
    Date of Patent: April 30, 1996
    Assignee: Compositech Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl
  • Patent number: 5478421
    Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
    Type: Grant
    Filed: September 28, 1993
    Date of Patent: December 26, 1995
    Assignee: Compositech Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl
  • Patent number: 5376326
    Abstract: A method for making a multilayered printed circuit board including the steps of arranging two plates in spaced relation, arranging a perimetral seal between the two plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, placing the chamber under vacuum, injecting a settable matrix material into the chamber, compressing the end plates towards one another to achieve the desired outer dimensions of the board, and curing the settable matrix material.
    Type: Grant
    Filed: August 23, 1989
    Date of Patent: December 27, 1994
    Assignee: Compositech Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl
  • Patent number: 5037691
    Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.
    Type: Grant
    Filed: August 23, 1989
    Date of Patent: August 6, 1991
    Assignee: Compositech, Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl
  • Patent number: 4943334
    Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.
    Type: Grant
    Filed: September 15, 1986
    Date of Patent: July 24, 1990
    Assignee: Compositech Ltd.
    Inventors: Jonas Medney, Fred E. Klimpl