Abstract: A packaging tray for a hard disk drive has a plurality of positioning holes. The packaging tray includes a box body, and the box body has a plurality of frame walls and an accommodating space surrounded by the frame walls. The box body has formed a plurality of positioning posts at a bottom of the accommodating space, and the positioning posts are disposed corresponding to the positioning holes of the hard disk drive. Therefore, the hard disk drive placed in the accommodating space will not contact dust in the box body, and the hard disk drive in the box body can avoid scratching.

Abstract: A heat sink device of solid state disk module includes a heat sink and at least one fixture. The heat sink includes a heat sink body heat conducting with the solid state disk and a pair of sliding slots disposed on the heat sink body. The fixture includes a bottom plate and a pair of side plates. The bottom plate has at least one rib, and the pair of side plates have pressing structures corresponding to the pair of the sliding slots. The pressing structure includes a flap being capable of pressing in the sliding slot and a pull-ab located at a side of the flap. The heat sink body is fixed on the solid state disk through the fixture, and an interval is maintained between the bottom plate and the solid state disk by the at least one rib.

Abstract: A hard disk includes a first cover member including a first cover plate and a pair of first lateral walls extended from edges of thereof, each of the first lateral wall is formed with a support piece and a latch hook respectively protruded towards inward, the support piece and the latch hook are not arranged at same horizontal level in a direction perpendicular to the first cover plate; a second cover member, disposed at the outer side of the first cover member and engaged with the first cover member; and a storage module, accommodated inside the first cover member and including a circuit board having edges thereof clamped between distal ends of the latch hooks and the support pieces. Accordingly, the assembly can be easily achieved through fastening the storage module in the first cover member then sleeving the first cover member and the second cover member.

Abstract: A heat dissipation unit used in a memory device includes two heat dissipation sheets, two sides at the top edge of each heat dissipation sheet are bent for respectively forming two lugs having a height difference, and two buckle pieces having a height difference between the two lugs, wherein each lug and each buckle piece of a heat dissipating sheet is mutually stacked onto a corresponding lug and buckle piece of the other heat dissipating sheet, respectively.

Abstract: A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.

Abstract: A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.

Abstract: A cooling device includes a base connected on a CPU and a pipe unit 2 includes a plurality of absorbing pipes which are engaged with the base. A plurality of cooling pipes are connected to two ends of the absorbing pipes and extend upward in V-shape. Two cooling units are connected to the cooling pipes and each cooling unit includes fins and a cooling fan which generates air flows toward the fins and cooling the parts around the CPU.

Abstract: A cooling device for memory chip includes a first part and a second part which is pivotably connected to the first part at a top thereof. Each of the first and second parts includes an elongate plate and fins extend from each of the elongate plates. Ventilation holes are defined through each the elongate plates and located between the fins. The memory chip is sandwiched between the first and second elongate plates of the first and second parts, and the fins of the two parts are arranged alternatively.

Abstract: An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the memory chips and the cooling plates to remove heat via air paths defined in the inside of each side board.

Abstract: A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of fins. A heat conduction member is connected with the cooling unit and inserted into a slot defined in one of the two side boards so as to directly in contact with the memory chips of the memory device. The heat is directly conducted to the heat conduction member and can be dispensed by the fins of the cooling unit.