Abstract: This invention is to manufacturing of SOI (Silicon On Insulator) wafer; with respect to manufacturing of SOI wafer, preparation process of silicon wafer with desired thickness (100), deposition of Alumina (Al2O3) as insulator by an ALE (Atomic Layer Epitaxial) method such as ALCVD, ALD, ASCVD, etc . . . (110), bonding of this wafer with another silicon wafer by various bonding methods (120), Cutting of this bonded wafer by various methods of cutting (130), Polishing the surface of the cut wafer (140). For the insulator material, titanium oxide (TiO2) or tantalum oxide (Ta2O5) can be used other than Alumina (Al2O3) and such bonding process can be done by unibonding method and cutting method can be done by Smart Cut process.

Abstract: A paper surface cleaning device for cleaning a surface of a printing paper running before being fed to a printing portion of a printing machine, which comprises a cleaning sheet having a water holding capacity in contact with the surface of the printing paper with a difference in running velocity between the printing paper and the cleaning sheet, a dampening roller which has, at its surface, a wettability so that water is attached to the surface of the dampening roller and which functions to push the cleaning sheet onto the surface of the printing paper, and a water pan into which the dampening roller is dipped partially. An even water film can be formed on the surface of the dampening roller to enable the cleaning sheet to get wet uniformly in its widthwise direction.

Abstract: A cleaning device is disclosed for an offset printing machine for quickly removing stains on a printed matter. A number of scrapers (7) are arranged in an axial direction of the surface of a printing drum (1) of the offset printing machine. The scrapers (7) are held by rods of air cylinders (8) which cause the scrapers to contact or be separated away from the surface of the drum (1). Solenoid valves are arranged corresponding to respective cylinders. The solenoid valves are controlled by a control unit (16). The position of hickey on the surface of the drum is designated from an information of a hickey position on the printed matter generated corresponding to the stain on the surface of the drum. When the associated solenoid valves are actuated, then the scrapers are brought into contact with the hickey position on the drum surface to scrape the hickey.