Abstract: A process for producing a strong, adherent protective layer on copper parts, with a high rate of covering of the substrate, by passivating anodization, characterized in that the copper parts are immersed in a liquid KF, 2HF bath and subjected to anodic current of low surface-related density which is less than 0.1 A/dm.sup.2, which current may be continuous or intermittent.
Type:
Grant
Filed:
February 23, 1989
Date of Patent:
January 9, 1990
Assignee:
Comurhex Societe Pour la Conversion de l'Ranium en Metal et Hexafluorure
Inventors:
Patrick Germanaz, Sylvie Lamirault, Gerard Picard