Abstract: A reflow solder convection oven with a passive gas decontamination subsystem. This subsystem includes an intake duct in fluid communication with the gas outtake of a heating zone of the oven, at least one decontamination duct connected on one end to the intake duct, the decontamination duct including a plurality of collision baffles therein for collecting contaminants from the gas in the oven, and an outtake duct connected to the decontamination duct on an end opposite the intake duct and in fluid communication on an opposite end with the gas intake of the heating zone.

Abstract: A reflow solder convection oven with at least one heater element and at least one blower assembly in fluid communication with the heater element. The blower assembly includes a mount structure including at least one intake port and at least two supply ports, a housing connected to the mount structure, a fan wheel, and a motor attached to the fan wheel. The housing has an interior surface defining at least two pressurization zones, and at least two outtake regions, each outtake region proximate a supply port of the mount structure. The periphery of the wheel is positioned in the housing to form dual pressurization zones, the housing defining at least two spline curves along the interior surface thereof, each curve having a starting node proximate a pressurization zone and a terminating node proximate an outtake region.

Abstract: A combination product cooling and flux management apparatus is mounted above a reflow soldering oven. The apparatus has a sealed housing with four openings: an ambient air inlet, an ambient air outlet, a recirculating gas inlet and a recirculating gas outlet. The recirculating gas blower is mounted in a first end of the housing and draws air into the recirculating gas inlet, through a recirculating gas side of a gas-to-gas heat exchanger and out the recirculating gas outlet, where it is recirculated through a product cooling chamber and back into the recirculating gas inlet. The ambient air blower is mounted in a second end of the housing and draws air into the ambient air inlet, through an ambient air side of the gas-to-gas heat exchanger and out the ambient air outlet to the surrounding atmosphere.

Abstract: A combination product cooling and flux management apparatus is mounted above a reflow soldering oven. The apparatus has a sealed housing with four openings: an ambient air inlet, an ambient air outlet, a recirculating gas inlet and a recirculating gas outlet. The recirculating gas blower is mounted in a first end of the housing and draws air into the recirculating gas inlet, through a recirculating gas side of a gas-to-gas heat exchanger and out the recirculating gas outlet, where it is recirculated through a product cooling chamber and back into the recirculating gas inlet. The ambient air blower is mounted in a second end of the housing and draws air into the ambient air inlet, through an ambient air side of the gas-to-gas heat exchanger and out the ambient air outlet to the surrounding atmosphere.