Abstract: A heat spreader for dissipating heat generated by at least one heat-generating power semiconductor device which, apart from an improved heat coupling between a chip and a heat sink, also comprise a flexible coupling assembly which can compensate for tolerances in the components and in the assembling process. The heat spreader has a base plate (11) which is connectable in a heat-conducting manner to the at least one power semiconductor device (2). The base plate (11) has at least one recess (12) in which at least one heat pipe (13) is arranged for dissipating the generated heat, and wherein the at least one heat pipe (13) is movably supported in the recess (12).

Abstract: A heat spreader for dissipating heat generated by at least one heat-generating power semiconductor device. Such a heat spreader comprises a base plate (11) which is connectable in a heat-conducting manner to the at least one power semiconductor device (2), and at least one heat coupling element (4) which is connected in a heat conducting manner to the at least one power semiconductor device (2) on the one hand and to the base plate (11) on the other hand and comprises at least one elastic layer (5). The heat coupling element (4) comprises at least one holding element for mechanically fixing the heat coupling element (4) relative to a plane defined by the base plate (11).