Patents Assigned to Consorzio per la Ricerca sulla Microelettronica net Mezzogiorno
  • Resin-encapsulated semiconductor device having improved adhesion
    Patent number: 5514913
    Abstract: A package for discrete semiconductor devices, wherein the insulating characteristics of the package are improved by introducing an opening, indentations, grooves and positioning holes in the metal plate and shaping in appropriate form the retractable positioning pins of the metal plate in the molding die.
    Type: Grant
    Filed: December 7, 1992
    Date of Patent: May 7, 1996
    Assignee: Consorzio per la Ricerca sulla Microelettronica net Mezzogiorno
    Inventors: Marcantonio Mangiagli, Rosario Pogliese