Abstract: A system for manufacturing substrates, in particular wafers, glass masks, and channels, having individual process stations for treating and/or processing the various substrates in a clean environment. A plurality of interchangeable and aligned process modules are provided which are connected and disconnected from a media bus in which inflow and outflow lines are situated. These lines serve to supply the process modules through the noted connection with chemicals, gases, liquids, data and energy as needed.

Abstract: An apparatus for in-line lacquering of compact disks, having a processing apparatus for the metered application of a lacquer bead to one surface of the compact disk and for uniformly distributing the lacquer bead over the surface of the compact disc by means of centrifugal force, and having a manipulator for delivering and removing the compact disks to and from the processing apparatus. To enable such an apparatus to operate faster, with unchanged quality of the lacquering, it is provided that the processing apparatus has a lacquer metering station and spaced apart from it a lacquer bead centrifuging station; that a loading station is disposed spaced apart from the lacquer metering station and an unloading station is disposed spaced apart by the same distance from the lacquer bead centrifuging station; and that the manipulator has three parallel grippers which are driven in common, movable in harmonic fashion, between two adjacent stations.

Abstract: An apparatus for the treatment of wafers in the manufacture of semiconductor elements in the form of a process buffer through which a plurality of wafers travel at the same time to various treatment stations and which cooperates with a transport apparatus for the wafers. The apparatus has a shaft magazine, in which the treatment stations, each for one wafer, are disposed spaced apart from and above one another. The shaft magazine is provided with a loading and unloading opening, and the treatment stations are movable individually into the vicinity of the loading and unloading opening. The apparatus occupies less surface area in the process line for the manufacture of semiconductor elements, enables treatment of the wafers independent of external factors, and can be used for various types of treatment of the wafers in the manufacture of semiconductor elements.