Abstract: A semiconductor package includes a metallic foil (10) having a front surface and a rear surface, which foil (10) is formed to have a recess portion (12) including a bottom and an extended border region (14) around the recess portion (12). A substrate (30) is attached to the front surface of the foil (10) over the border region (14) to provide a support for electrical connection of a semiconductor element (40). The substrate (30) has an opening exposing the recess portion (12). A stiffener (20) is formed on the rear surface of the foil (10) for enhancing the rigidity of the foil (10). The stiffener (20) extends over the border region (14) and around the recess portion (12), with the rear surface of the bottom of the recess portion (12) exposed for heat dissipation. A semiconductor element (40) is mounted on the bottom of and within the recess portion (12).

Abstract: An electro-optical package insertable into a motherboard of an electronic component permits the package to receive electrical and/or optical signals from the motherboard, converts the electrical signals into optical signals and transmit the optical signals within the package, and emits the optical signals from the package and/or convert the optical signals back into electrical signals for emission from the package.