Patents Assigned to Cookson Electronics Co.
  • Process for forming metal layers
    Patent number: 7416763
    Abstract: A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: August 26, 2008
    Assignee: Cookson Electronics Co.
    Inventors: Yuichi Kanda, Takashi Abe, Atsushi Tanaka, Keisuke Nishu