Patents Assigned to Cookson Singapore PTE LTD c/o Alpha Metals, Inc.
  • Epoxy mold compound and method
    Patent number: 6214905
    Abstract: Mold compounds for encapsulating semiconductors are disclosed. The compounds achieve high levels of adhesion to uncleaned printed wiring board substrates by minimizing the level of silicone fluid in the compound. Methods for encapsulating semiconductor dies and processes for encapsulating the dies also are disclosed.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: April 10, 2001
    Assignee: Cookson Singapore PTE LTD c/o Alpha Metals, Inc.
    Inventor: David William Garrett