Abstract: In accordance with various embodiments, lighting systems features one or more inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels may feature one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals. One or more of the light panels may include sound-absorbing material therebelow and may define one or more apertures and/or cut-out regions that reveal the sound-absorbing material.

Abstract: In various embodiments, lighting systems include a carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs), each of which has at least two electrical contacts electrically connected to conductive elements.

Abstract: In accordance with certain embodiments, systems of lighting components feature multiple illumination panels each having a backing support and, secured thereto, multiple illumination elements. The illumination elements have shapes defined by arrangements of illumination unit cells may be assembled to illuminate an arbitrary two-dimensional area.

Abstract: In accordance with various embodiments, lighting systems features one or more inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels may feature one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals. One or more of the light panels may include sound-absorbing material therebelow and may define one or more apertures and/or cut-out regions that reveal the sound-absorbing material.

Abstract: In accordance with certain embodiments, lighting systems include flexible light sheets and one or more sealed regions containing light-emitting elements, the sealed regions defined by seals between a top housing and a bottom housing and/or the light sheet.

Abstract: In accordance with certain embodiments, lighting systems include flexible light sheets and one or more sealed regions containing light-emitting elements, the sealed regions defined by seals between a top housing and a bottom housing and/or the light sheet. The top housing defines a plurality of shaped regions each associated with a light-emitting element and spaced apart from and not in contact with the light-emitting element with which it is associated.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, lighting systems include flexible light sheets having light-emitting elements with first luminous intensity distributions disposed thereover, and the light sheets are curved or folded to produce a second luminous intensity distribution different from the first luminous intensity distribution.

Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.

Abstract: In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of electrically connected light-emitting diodes (LEDs). Each LED has at least two electrical contacts, and each electrical contact is electrically connected to a conductive element. The power source provides power to the light-emitting strings.

Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract: In accordance with various embodiments, a modular lighting system features multiple light panels each having multiple light-emitting elements thereon, as well as connectors for electrically and mechanically interconnecting the light panels.

Abstract: Changes in light intensity emitted by an illumination system are controlled by receiving signals to initiate dimming, determining a present value of the output drive signal, computing a change increment for the output drive signal based on the present value of the output drive signal, and changing the output drive signal by the change increment. The change increment is a first value if the present value of the output drive signal is less than a threshold, and the change increment is a second value greater than the first value if the present value of the output drive signal is greater than the threshold.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.

Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.

Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.

Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.