Abstract: A computer power supply assembly (PSA) is provided. The PSA comprises an AC/DC power supply unit (PSU) and a DC/DC converter module. The DC/DC converter module is attached to the AC/DC power supply unit via conductor which may be a conductive bridge that holds the AC/DC PSU in fixed relation to the DC/DC converter module, or may be a conductive cable with, for example, a twist connector. The DC/DC converter module is replaceable and interchangeable. Different types of DC/DC converter modules having different numbers and combinations of connectors for attachment to the electronics system devices and different wattage and efficiency can be electrically connected to the PSU via the one conductor.

Abstract: A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

Abstract: A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

Abstract: A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

Abstract: A heat dissipating device includes a bottom assembly, a first light guide positioned on the bottom assembly, a first light assembly positioned on the first light guide, and an outer cover positioned on the bottom assembly and at least partially enclosing the bottom assembly, the first light guide, and the first light assembly. The outer cover defines a first opening on a top surface thereof, at least a portion of the first light guide is received in the first opening, and light from the first light assembly is emitted from the heat dissipating device through the exposed portion of the first light guide.

Abstract: A cooling apparatus that includes a base plate configured to dissipate heat and including a heat exchange unit, and a cover member coupled to the base plate and at least partially enclosing the heat exchange unit. The cover member and the base plate define a heat exchange chamber that includes the heat exchange unit. The cover member defines a first opening and a second opening, and at least one of the first and second openings are above the heat exchange unit. The cooling apparatus further includes a flow guidance plate disposed on the cover member and a housing disposed on the flow guidance plate.

Abstract: A flat heat pipe includes a flat hollow pipe and a capillary structure. The flat hollow pipe has a first flat portion, a second flat portion and two arc portions, wherein the two arc portions are connected to both sides of the first and second flat portions. The capillary structure is formed in the flat hollow pipe. The capillary structure has a central portion and two edge portions, wherein the central portion is located on an inner wall of the first flat portion, the two edge portions are located on inner walls of the two arc portions respectively, and a thickness of the central portion is smaller than a thickness of each of the two edge portions.

Abstract: A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

Abstract: A heat dissipating device includes a heat dissipating fin module, a second base, a third base, a heat pipe, a first sleeve and a fourth base. The heat dissipating fin module includes a first base and a plurality of first heat dissipating fins. A recess is formed on the second base. The third base is disposed in the recess. The heat pipe includes a heat dissipating segment, a heat absorbing segment and a connecting segment connecting the heat dissipating segment and the heat absorbing segment. The heat dissipating segment is disposed in the first base. The heat absorbing segment is disposed in the second and third bases and contacts the third base directly. The first sleeve at least covers the connecting segment. The fourth base is formed by a die casting process and covers peripheries of the first and second bases and the first sleeve.

Abstract: A fan includes a fan frame and a fan wheel. The fan frame includes a frame body and at least two vibration-proof members. The frame body has at least two positioning ribs, wherein the at least two positioning ribs protrude from a side wall of the frame body and are distributed symmetrically. Each of the vibration-proof members has a positioning groove. The positioning rib of the frame body is capable of being embedded in the positioning groove of the vibration-proof member so as to position the vibration-proof member on the side wall of the frame body. The fan wheel is rotatably disposed in the fan frame.

Abstract: A handheld operation device includes a casing, a plurality of counterweight blocks and a counterweight module. The counterweight module is disposed on the casing. The counterweight module includes a base and a block plate. The block plate covers the base. One of the base and the block plate is capable of rotating with respect to the casing. The base has a plurality of accommodating recesses. The block plate has a broken hole formed thereon. One of the accommodating recesses is exposed in the broken hole such that one of the counterweight blocks is capable of passing through the broken hole and then being disposed in the accommodating recess.

Abstract: A fan includes a fan frame and a fan wheel. The fan frame includes a frame body and a first waved structure. The frame body has a wind enter side and a wind exhaust side, wherein the wind enter side is opposite to the wind exhaust side. The first waved structure is formed on the wind enter side of the frame body. The first waved structure has a plurality of first peaks and a plurality of first valleys, wherein the first peaks and the first valleys are arranged separately. The fan wheel is rotatably disposed in the fan frame.

Abstract: A heat dissipating device includes a heat dissipating fin module, a second base, a third base, a heat pipe, a first sleeve and a fourth base. The heat dissipating fin module includes a first base and a plurality of first heat dissipating fins. A recess is formed on the second base. The third base is disposed in the recess. The heat pipe includes a heat dissipating segment, a heat absorbing segment and a connecting segment connecting the heat dissipating segment and the heat absorbing segment. The heat dissipating segment is disposed in the first base. The heat absorbing segment is disposed in the second and third bases and contacts the third base directly. The first sleeve at least covers the connecting segment. The fourth base is formed by a die casting process and covers peripheries of the first and second bases and the first sleeve.

Abstract: A bearing structure includes a non-metallic column-shaped main body having a through hole, an inner wall surrounding the through hole and an outer wall surrounding the inner wall. The outer wall has at least two protruding blocks extending outward and at least one groove, wherein the groove is arranged between the two neighboring protruding blocks. A fan includes a housing a stator winding, a bearing structure and a rotation piece. The housing has a base and an accommodating space. The stator winding is disposed in the accommodating space and surrounding the base. The bearing structure is disposed in the base. The rotation piece is disposed in the accommodating space, and has a rotation case, an axial shaft connected to the rotation case and a plurality of blades each connected to the rotation case.

Abstract: A method of manufacturing a heat dissipating base includes steps of providing a first base, wherein the first base is made of a first heat conducting material; putting the first base into a mold; pouring a second heat conducting material, which is melted, into the mold, wherein a thermal conductivity of the first heat conducting material is larger than that of the second heat conducting material; and processing the second heat conducting material by a die casting process, so as to form a second base, wherein the second base covers a periphery of the first base and an upper surface and a lower face of the first base are exposed.

Abstract: A plate-type heat exchanger includes a casing having a chamber therein; and a support structure in the chamber and including a plurality of frameworks, any two of the frameworks distributing to each other at a distance; and a plurality of support portions, the support portions connecting with the frameworks in order to surround a plurality of hollow areas and being vertical, each of the support portions and each of the frameworks being combined by means of a twisted stagger; wherein the upper and lower positions of the support portion form an urging edge respectively, the two urging edges being against the upper inner side and the lower inner side of the casing respectively.