Patents Assigned to Cooler Master Technology Inc.
  • Patent number: 12761709
    Abstract: A monitor riser may include a casing and KVM switch. The casing includes an internal space and supports a monitor. The KVM switch is disposed in the internal space and includes a KVM unit, I/O unit, first port, second port, HMI unit, and expansion unit having a speaker. The KVM unit is electrically coupled to the first port and second port, HMI unit, I/O unit, and expansion unit. A keyboard, monitor and mouse is electrically coupled to the I/O unit. The HMI unit detects a touch input and generates a first signal and second signal. The KVM unit receives the first signal and electrically couples a first computing device electrically coupled to the first port to the keyboard, monitor, mouse, and speaker, and receives the second signal and electrically couples a second computing device electrically coupled to the second port to the keyboard, monitor, mouse, and speaker.
    Type: Grant
    Filed: January 10, 2025
    Date of Patent: October 13, 2026
    Assignee: Cooler Master Technology Inc.
    Inventor: Soong Hui San
  • Patent number: 12753869
    Abstract: A liquid coupler may include a first adaptor component, second adaptor component, fixing component, and plurality of connecting assemblies. A first liquid line is disposed through the first adaptor component and a second liquid line is disposed through the second adaptor component. Each plurality of connecting assemblies includes a locking component and receiving component. The locking component is coupled to the first adaptor component and the receiving component is coupled to the second adaptor component. The plurality of connecting assemblies is configured to enable the first liquid line to fluidly couple to the second liquid line via a pushing force. The fixing component is positioned between the first adaptor component and second adaptor component and when the first adaptor component is locked to the second adaptor component, the fixing component is configured to deform and fix the first liquid line to the first adaptor component.
    Type: Grant
    Filed: December 25, 2024
    Date of Patent: October 6, 2026
    Assignee: Cooler Master Technology Inc.
    Inventor: Chen Chou Kao
  • Patent number: 12688762
    Abstract: A vibrotactile device and method including an audio signal input unit, manual parameter input unit, microcontroller, vibration motor controller, and at least one vibration motor are provided. The microcontroller is coupled to the audio signal input unit and manual parameter input unit. The vibration motor controller is coupled to the microcontroller and the at least one vibration motor. At least one signal is generated by at least the audio signal input unit or the manual parameter input unit. A modulated signal is generated based, in part, on a filtered signal from the audio signal input unit and a vibration duty cycle is generated, based on a tempo value and a note value of the manual parameter input unit, to generate at least one driving parameter, respectively. The vibration motor controller drives the at least one vibration motor based on the at least one driving parameter.
    Type: Grant
    Filed: November 23, 2023
    Date of Patent: July 21, 2026
    Assignee: Cooler Master Technology Inc.
    Inventors: Chi-Min Lin, Yao Shiao, Chun-Ta Chen, Shang che Lee, Ming Wan Lien
  • Publication number: 20260201905
    Abstract: A fan includes a fan and a light emitting assembly. The fan has a first engaging portion and an electrically connecting portion. The electrically connecting portion is located at the first engaging portion. The light emitting assembly includes a back plate, a conductive structure and a light emitting component. The back plate is disposed on the fan, and has a through slot and a second engaging portion. The second engaging portion is located at the through slot. The second engaging portion is engaged with the first engaging portion. The conductive structure is disposed through the through slot. The conductive structure is located at the second engaging portion. The conductive structure is connected to the electrically connecting portion via the first engaging portion and the second engaging portion. The light emitting component is disposed on the back plate. The conductive structure is connected to the light emitting component.
    Type: Application
    Filed: December 10, 2025
    Publication date: July 16, 2026
    Applicant: COOLER MASTER TECHNOLOGY INC.
    Inventor: Jheng-Sian CAI
  • Publication number: 20260161201
    Abstract: A computer cabinet includes a main frame having two subframes and four frame beams, each subframe includes four subframe beams and four frame joints, each subframe beam having one frame joint connected to opposite ends, and support beams attached to the main frame. The frame joint is a hollow structure having a joint body and a joining member, the joining member extends from the joint body in a direction perpendicular to the subframe beams connected to the corresponding frame joint. Each frame beam has an elongated channel positioned within each frame beam to connect with the respective joining member extending from the joint body, each frame beam and each subframe beam has two edges extending away from the frame beam and the subframe beam respectively, the two edges are extending away from each other, a plurality of frame holes formed on each edge and used for attaching the support beams.
    Type: Application
    Filed: December 11, 2025
    Publication date: June 11, 2026
    Applicant: Cooler Master Technology Inc.
    Inventors: CHEN-CHOU KAO, Yuqing LYU, Chaofeng ZENG
  • Publication number: 20260161203
    Abstract: A computer cabinet includes a main frame having a frame joint and three frame beams connected to the frame joint, and support beams attached to the main frame. The frame joint is a hollow structure having a joint body and three joining members. The three joining members extend from the joint body to three different directions respectively. Each frame beam has an elongated channel positioned within each frame beam to connect with the respective joining member extending from the joint body. Each frame beam has two edges extending away from the frame beam. The two edges are extending away from each other. A plurality of frame holes are formed on each edge and used for attaching the support beams.
    Type: Application
    Filed: January 16, 2025
    Publication date: June 11, 2026
    Applicant: Cooler Master Technology Inc.
    Inventors: CHEN-CHOU KAO, YUN HAN SHIH
  • Publication number: 20260164599
    Abstract: An expansion card can includes a first housing, a second housing coupled with the first housing to define an internal space, the second housing having at least one ventilation opening communicating with the internal space, a substrate disposed on the first housing and within the internal space, a heat dissipation device disposed on the substrate, and at least one fan disposed on the second housing and within the internal space, and located at the corresponding ventilation opening.
    Type: Application
    Filed: November 19, 2025
    Publication date: June 11, 2026
    Applicant: COOLER MASTER TECHNOLOGY INC.
    Inventors: Ming-Chun HSU, Chen-Chou KAO
  • Publication number: 20260150225
    Abstract: An electronic device includes a housing having a housing body, a cover containing a first side panel and a second side panel, the housing having an accommodation space, the first and second side panels covering adjacent sides of the accommodation space, the first side panel having an air inlet, the second side panel having an air outlet, the air inlet and air outlet are configured to communicate with the accommodation space, an intake fan disposed in the accommodation space, the intake fan being adjacent to the first side panel, and a wind deflector disposed on the first side panel, the wind deflector having at least one ventilation opening corresponding to the intake fan, and the air inlet is configured to communicate with the accommodation space through the at least one ventilation opening.
    Type: Application
    Filed: November 20, 2025
    Publication date: May 28, 2026
    Applicant: COOLER MASTER TECHNOLOGY INC.
    Inventor: Yun-Han SHIH
  • Publication number: 20260040511
    Abstract: A computer power supply unit including a housing, a main board disposed in the housing, at least one high heat producing component disposed on the main board, at least one other heat producing component disposed on the main board, and a heat transfer system is provided. The heat transfer system comprises bottom and top heat transfer devices. Thermal paths are formed between the bottom heat transfer device and a bottom panel of the housing and the top heat transfer device and a top panel of the housing to dissipate heat from an at least one high heat component assembly, formed in part by the at least one high heat producing component, and an at least one other heat component assembly, formed in part by the at least one other heat producing component, to an outside of the bottom panel and an outside of the top panel.
    Type: Application
    Filed: October 10, 2025
    Publication date: February 5, 2026
    Applicant: COOLER MASTER TECHNOLOGY INC.
    Inventors: I-Chia Lee, Jen-Chih CHENG, Jui-Tse Yin
  • Publication number: 20260029859
    Abstract: Aspects of the disclosure provide a modular control device. The modular control device includes a module base having a main control body having a plurality of first electrical connectors and a plurality of first positioning structures, and an expandable control body having a plurality of first electrical connectors and a plurality of first positioning structures, wherein the expandable control body is movably positioned with respect to the main control body and configured to move between a retracted position and an extended position, and a plurality of electronic modules, each electronic module having a second electrical connector and a plurality of second positioning structures, wherein each electronic module is detachably connectable to the module base via connection of the second electrical connector to one of the first electrical connectors and positioning of the second positioning structures with the first positioning structures for electrical connection and mechanical positioning.
    Type: Application
    Filed: October 6, 2025
    Publication date: January 29, 2026
    Applicant: Cooler Master Technology Inc.
    Inventor: Bryant Quac Bao Manh Nguyen
  • Publication number: 20260032849
    Abstract: An installation assembly configured for mounting a motherboard includes a plurality of parallel mounting rods, each having a plurality of first fastening structures arranged along a longitudinal direction. The installation assembly further includes a tray configured to receive the motherboard and a plurality of second fastening structures disposed on the tray and selectively engageable with the first fastening structures. When disengaged from the first fastening structures, the tray is movable along the longitudinal direction of the mounting rods to adjust a positional relationship between the tray and the mounting rods.
    Type: Application
    Filed: July 10, 2025
    Publication date: January 29, 2026
    Applicant: COOLER MASTER TECHNOLOGY INC.
    Inventors: YUQING LYU, CHAOFENG ZENG
  • Patent number: 12513869
    Abstract: A computer power supply unit including a housing, a main board disposed in the housing, at least one high heat producing component disposed on the main board, at least one other heat producing component disposed on the main board, and a heat transfer system is provided. The heat transfer system comprises bottom and top heat transfer devices. Thermal paths are formed between the bottom heat transfer device and a bottom panel of the housing and the top heat transfer device and a top panel of the housing to dissipate heat from an at least one high heat component assembly, formed in part by the at least one high heat producing component, and an at least one other heat component assembly, formed in part by the at least one other heat producing component, to an outside of the bottom panel and an outside of the top panel.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: December 30, 2025
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventors: I-Chia Lee, Jen-Chih Cheng, Jui-Tse Yin
  • Publication number: 20250328199
    Abstract: A virtual reality control systems includes a base, a dynamic carrier that is disposed on the base and is configured to move along at least one rotational axis, and a control device that is connected to the dynamic carrier and is configured to determine a virtual rotation angle corresponding to a virtual operation, convert the virtual rotation angle into a carrier rotation angle, and control the rotational movement of the dynamic carrier based on the carrier rotation angle. The angle conversion function maps a virtual angle range to a carrier angle range in a nonlinear manner, such that the virtual rotation angle is within the virtual angle range and the carrier rotation angle is within the carrier angle range.
    Type: Application
    Filed: April 4, 2025
    Publication date: October 23, 2025
    Applicant: COOLER MASTER TECHNOLOGY INC.
    Inventors: CHUN-TA CHEN, YAO SHIAO, SHANG-CHE LEE, MING-WAN LIEN
  • Publication number: 20250300687
    Abstract: A modularized wireless signal receiver includes a plurality of function modules. Each of the function modules is detachably connected another one of the function modules through a transmission line set. The function modules include: an application module, a main control module and a battery module. The main control module includes a wireless communication element electrically coupled to the application module. The wireless communication element is configured to receive a wireless signal and control an operation of the application module accordingly. The battery module includes a battery, and the battery module is electrically coupled to the application module and the main control module. The battery module is configured to provide power to the application module and the main control module.
    Type: Application
    Filed: March 18, 2025
    Publication date: September 25, 2025
    Applicant: COOLER MASTER TECHNOLOGY INC.
    Inventors: CHUN-TA CHEN, YAO SHIAO, SHANG-CHE LEE, MING-WAN LIEN
  • Publication number: 20250292942
    Abstract: A power supply having a circuit board, a heat dissipation housing, and a plurality of heat-generating assemblies. Each of the heat-generating assemblies includes a thermal conductive core that is thermally in contact with the heat dissipation housing, and a magnetic coil that is disposed on the thermal conductive core and electrically connected to the circuit board, wherein the magnetic coils of the heat-generating assemblies are coaxially arranged and connected in series through the circuit board.
    Type: Application
    Filed: March 5, 2025
    Publication date: September 18, 2025
    Applicant: COOLER MASTER TECHNOLOGY INC.
    Inventors: Yen-Chuan CHEN, Chia-Wei LIN
  • Patent number: 12114457
    Abstract: A modular power supply is disclosed. The modular power supply includes a power supply unit and an expansion unit. The expansion unit is detachably disposed on the power supply unit and located on one side of the power supply unit in a thickness direction of the modular power supply.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: October 8, 2024
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventors: Hsin-Hung Chen, Jui-Tse Yin
  • Publication number: 20230007802
    Abstract: A modular power supply is disclosed. The modular power supply includes a power supply unit and an expansion unit. The expansion unit is detachably disposed on the power supply unit and located on one side of the power supply unit in a thickness direction of the modular power supply.
    Type: Application
    Filed: January 19, 2022
    Publication date: January 5, 2023
    Applicant: COOLER MASTER TECHNOLOGY INC.
    Inventors: Hsin-Hung CHEN, Jui-Tse YIN
  • Patent number: D993316
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: July 25, 2023
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventors: Roger Lin, Che Ning Sha
  • Patent number: D1085089
    Type: Grant
    Filed: January 22, 2024
    Date of Patent: July 22, 2025
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventors: Chung-Bi Lee, Hung-Wei Chang, Ting Ou Yang, Soong Hui San
  • Patent number: D1148759
    Type: Grant
    Filed: August 5, 2025
    Date of Patent: September 22, 2026
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventors: Kok Keong Tan, Yung-Chun Chen, I-Hsian Chen, Chia-Hsiang Chi, Geeng Jieh Chong