Abstract: Leak detectors can have a sensor configured to detect a presence of a working fluid externally of a liquid-based heat-transfer system. The leak detector can also have an electrical circuit configured to emit a signal responsive to a detected presence of the working fluid externally of the liquid-based heat transfer system. Methods of detecting a leak of a working fluid from a liquid-based heat-transfer system can include sensing a presence or an absence of a working fluid externally of a liquid-based heat-transfer system. The methods can include generating a tachometer signal in correspondence with a sensed absence and a sensed presence of the working fluid. The methods can include monitoring the generated tachometer signal.

Abstract: Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from a heat dissipator. A manifolded heat exchanger can be configured to receive heated working fluid from a plurality of heat-transfer elements and to reject heat to a working fluid of a second fluid circuit. In some embodiments, the heat exchanging manifold can split an incoming flow of working fluid from the second fluid circuit into two or more streams having different bulk flow directions. In some instances, heat exchanger portions of the heat exchanging manifold are configured to provide counter flow heat exchange between the working fluid of the first fluid circuit and the working fluid of the second fluid circuit.

Abstract: A fluid heat exchanger can define a plurality of microchannels each having a first end and an opposite end and extending substantially parallel with each other microchannel. Each microchannel can define a continuous channel flow path between its respective first end and opposite end. A fluid inlet opening for the plurality of microchannels can be positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels can be positioned adjacent each of the microchannel first ends, and an opposite fluid outlet opening from the plurality of microchannels can be positioned adjacent each of the microchannel opposite ends such that a flow of heat transfer fluid passing into the plurality of microchannels flows along the full length of each of the plurality of microchannels outwardly from the fluid inlet opening. Related methods are disclosed.

Abstract: A fluid heat exchanger includes: a heat spreader plate including an intended heat generating component contact region; a plurality of microchannels for directing heat transfer fluid over the heat spreader plate, the plurality of microchannels each having a first end and an opposite end and each of the plurality of microchannels extending substantially parallel with each other microchannel and each of the plurality of microchannels having a continuous channel flow path between their first end and their opposite end; a fluid inlet opening for the plurality of microchannels and positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels at each of the microchannel first ends; and an opposite fluid outlet opening from the plurality of microchannels at each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that any flow of heat transfer fluid that passes into the plurality of microc

Abstract: A fluid heat exchanger can define a plurality of microchannels, each having a first end and an opposite end and extending substantially parallel with each other microchannel. Each microchannel can define a continuous channel flow path between its respective first end and opposite end. A fluid inlet opening for the plurality of microchannels can be positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels can be positioned adjacent each of the microchannel first ends, and an opposite fluid outlet opening from the plurality of microchannels can be positioned adjacent each of the microchannel opposite ends such that a flow of heat transfer fluid passing into the plurality of microchannels flows along the full length of each of the plurality of microchannels outwardly from the fluid inlet opening. Related methods are disclosed.

Abstract: A housing can have a cap, a base member and a mid-portion positioned between and removably coupled with the cap and the base member. The cap and the mid-portion can define a reservoir therebetween and the cap can define a recessed inner wall in fluid communication with the reservoir. The mid-portion can define a recessed impeller chamber configured to receive a pump impeller. The mid-portion can further define a retainer positioned between the impeller chamber and the inner chamber. A resiliently compressible member can be positioned within the inner chamber and configured to resiliently compress in response to a volumetric expansion of the liquid coolant. The retainer can contact the resiliently compressible member to prevent the resiliently compressible member from moving out of the reservoir or into a position blocking a liquid coolant flow through a port. The mid-portion can define a housing wall forming the retainer.

Abstract: A pump can have a housing defining therein an inner chamber of fixed volume. An inlet through the housing can provide communication to the inner chamber and an outlet through the housing can provide communication to the inner chamber. A pumping mechanism can be positioned in the inner chamber. A resiliently, compressible member can accommodate a portion of the fixed volume of the inner chamber.

Abstract: A heat exchanger includes: a heat spreader plate; plural microchannels for directing heat transfer fluid over the heat spreader plate, wherein each microchannel has a first end and an opposite end, extends substantially parallel with each other microchannel, and has a continuous flow path between the first and opposite ends; a fluid inlet opening for the microchannels and positioned between the first and opposite ends, a first fluid outlet opening from each of the microchannel first ends; and an opposite fluid outlet opening from each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that a flow fluid that passes into the plurality of microchannels, flows along the plurality of microchannels outwardly from the fluid inlet opening. A method of cooling a heat generating component uses a fluid heat exchanger that splits a mass flow of coolant.

Abstract: A bracket, computer component and method for connecting to connection points associated with a socket on a computer circuit board are provided. The bracket and computer component have a mounting device including a fastener connectable to one of the connection points and positioned on a mounting flange. The mounting device is adjustable relative to the mounting flange from a first position on the mounting flange to a second position to allow the bracket and computer component to be used in conjunction with a number of different types of sockets.

Abstract: A method for cooling an electronic component includes: providing an electronic component and a cooling device to cool the electronic component; determining the heat generating ability of the electronic component; and driving operation of the cooling device to cool the electronic component based on the heat generating ability of the electronic component. An apparatus and/or an electronics cooling device are provided based on the method.

Abstract: A bracket, computer component and method for connecting to connection points associated with a socket on a computer circuit board are provided. The bracket and computer component have a mounting device including a fastener connectable to one of the connection points and positioned on a mounting flange. The mounting device is adjustable relative to the mounting flange from a first position on the mounting flange to a second position to allow the bracket and computer component to be used in conjunction with a number of different types of sockets.

Abstract: Systems, devices and methods for generating a virtual mapping of a room are provided. A plurality of racks for housing servers, a plurality of position determining devices and a plurality of temperature sensors can be provided. A computer can be operatively connected to the plurality of position determining devices and the temperature sensors. Each position determining device can be associated with one or more of the temperature sensors. For each of the temperature sensors, position information can be obtained from the position determining device associated with the temperature sensor and the position information used to plot the temperature sensor in a virtual mapping of the room. The virtual mapping can then be used to visually represent a location in the room where a temperature measurement was taken.

Abstract: An apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump. The fluid heat exchanger transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated. The body has a protrusion having a first surface that may be thermally coupled to the hot portion such that the surface of the body is sufficiently distant from the surface of the electronic device that sufficient ambient air may circulate therebetween so as to substantially prevent condensation from forming on the surface of the electronic device and from forming on and dripping from the heat exchanger when the fluid is cooled to at least the dew point of the ambient air and circulated through the body. A heat-conducting path is provided from the first surface to a region of the body that is thermally coupled to the fluid when the fluid is circulated through the body.

Abstract: A connector and a connection system for a liquid cooling system for a computer are provided. The connector has a cylindrical base and a sealing ring encircling the base. A retaining channel is provided on the base to receive a retaining device. One of the components in the liquid cooling system has a liquid port with a cavity having an inner surface, an opening in fluid communication with the cavity and a fluid passage in fluid communication with the cavity. The base of the connector is sized to fit within the liquid port so that when the base is inserted in the liquid port, the sealing ring is forced against an inner surface of the liquid port, forming a seal between the sealing ring and the inner surface of the liquid port.

Abstract: A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube.

Abstract: A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing for liquid-to-vapor transformation. A partition divides the upper portion of the cooling housing from the lower portion. A heat rejecter is disposed on and above the upper wall of the cooling housing with a first header extending from and in fluid communication with the liquid coolant outlet. A second header extends upwardly from a rejecter outlet. A plurality of first tubes extend between and in fluid communication with the first header and the second header with a plurality of first air fins disposed between the upper wall and the first tubes. A single unit defines both the cooling housing and the air cooled heat rejecter to thereby allow the manufacture of the unit in a single process with the attendant reduction in shipping, handling and installation.

Abstract: Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1 and 3 and each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a primary nozzle, and a plurality of secondary nozzles. In the first embodiment shown in FIG. 1, the housing and the nozzle plate are circular in shape. In the second embodiment shown in FIG. 3, the housing and the nozzle plate are rectangular in shape. Both embodiments include a plurality of secondary nozzles that are aligned outwardly of the primary nozzle and the center axis of the nozzle plate. The secondary nozzles direct the flow of the cooling liquid outwardly of the primary nozzle from the center thus creating an overall system pressure drop lower than that of other assemblies without a plurality of secondary nozzles.

Abstract: A cooling system for cooling a room containing a plurality of computer devices is provided. The cooling system has a number of cooling supplies and at least one temperature sensor. Using the at least one temperature sensor and altering the cooling supplied to the room by the cooling supplies, the affect of each cooling supply on the temperature of the room can be approximated and used for the operation of the cooling system.

Abstract: A fluid heat exchanger includes: a heat spreader plate including an intended heat generating component contact region; a plurality of microchannels for directing heat transfer fluid over the heat spreader plate, the plurality of microchannels each having a first end and an opposite end and each of the plurality of microchannels extending substantially parallel with each other microchannel and each of the plurality of microchannels having a continuous channel flow path between their first end and their opposite end; a fluid inlet opening for the plurality of microchannels and positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels at each of the microchannel first ends; and an opposite fluid outlet opening from the plurality of microchannels at each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that any flow of heat transfer fluid that passes into the plurality of microc

Abstract: A method for providing a computer component includes providing a motherboard apart from a cooling solution such that the end user can select the motherboard and cooling solution separately, based on preferences and needs for each and connect them together after they are selected. To support this method, a motherboard includes: a support board; a chipset mounted on the support board; and a heat sink base mounted over the chipset, the heat sink base including an open, planar upper surface devoid of any cooling system working components pre-installed thereon but including a fastener aperture about the edge of the open, planar upper surface and in addition to any support board mounting connections, the fastener aperture formed to accept releasable connectors for securing the selected cooling working component.