Patents Assigned to Coors Electronic Package Company
  • Method for obtaining via patterns in ceramic sheets
    Patent number: 5302219
    Abstract: A process for producing via patterns in a ceramic sheet which includes the steps of forming an array of vias and then selectively filling in at least a portion of the vias with a non-conductive filler material, such as a ceramic, to create a custom via pattern. The process is particularly useful for fabricating grid transformers and ceramic printed circuit boards. The present invention also relates to ceramic devices produced by the process, and a universal tool adapted for carrying out the process.
    Type: Grant
    Filed: April 3, 1991
    Date of Patent: April 12, 1994
    Assignee: Coors Electronic Package Company
    Inventor: Billy M. Hargis
  • Process for obtaining side metallization and articles produced thereby
    Patent number: 5276963
    Abstract: A process for the formation of side metallization in ceramic sheets is provided by the present invention. The process includes the steps of forming a via within the ceramic sheet and splitting the via to expose the metallization contained therein. The process is particularly useful for forming wraparound metallization on feedthroughs utilized in hermetic packages.
    Type: Grant
    Filed: February 21, 1992
    Date of Patent: January 11, 1994
    Assignee: Coors Electronic Package Company
    Inventor: Michael W. Flanders