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Patents
Patents Assigned to Copprint Technologies Ltd
Patents Assigned to Copprint Technologies Ltd
FORMULATIONS AND PROCESSES FOR PRODUCING HIGHLY CONDUCTIVE COPPER PATTERNS
Publication number:
20240327668
Abstract:
This disclosure concerns formulations and processes for obtaining conductive patterns of copper onto a substrate.
Type:
Application
Filed:
June 14, 2024
Publication date:
October 3, 2024
Applicant:
COPPRINT TECHNOLOGIES LTD
Inventor:
Michael GROUCHKO
FORMULATIONS AND PROCESSES FOR PRODUCING HIGHLY CONDUCTIVE COPPER PATTERNS
Publication number:
20190177566
Abstract:
Provided are formulations and processes for obtaining conductive patterns of copper onto a substrate.
Type:
Application
Filed:
August 3, 2017
Publication date:
June 13, 2019
Applicant:
Copprint Technologies Ltd
Inventor:
Michael GROUCHKO