Abstract: Thermosetting phenol-formaldehyde resins having novel structures and properties are described. In one embodiment, there is provided a novel thermosetting phenol-formaldehyde resin having benzyl ether linkages ortho to the phenolic hydroxyl group and characterized by its infra-red spectrum which exhibits absorption at wave numbers of about 1010 cm.sup.-1, 1060 cm.sup.-1 and 1230 cm.sup.-1. The infra-red spectrum has a particular ratio of absorbance at 1010 cm.sup.-1, measured from a base line drawn between wave numbers of 1030 cm.sup.-1 and 950 cm.sup.-1, to that at 1230 cm.sup.-1, measured from a base line drawn between wave numbers of 1130 cm.sup.-1 and 1310 cm.sup.-1 which is less than about 0.1. These novel resins are prepared by the controlled addition of strong acids to thermosetting phenol-formaldehyde resins having the benzyl ether linkages and an infra-red spectrum exhibiting large adsorption at wave numbers of 1230 cm.sup.-1, 1060 cm.sup.-1 and 1010 cm.sup.

Abstract: A novel thermosetting phenol-formaldehyde resin having a preponderance of benzyl ether linkages is characterized by its infra-red spectrum which exhibits absorption at wave numbers of about 1010 cm.sup.-.sup.1, 1050 cm.sup.-.sup.1 and 1230 cm.sup.-.sup.1. The infrared spectrum has a particular ratio of absorbance at 1010 cm.sup.-.sup.1, measured from a base line drawn between wave members of 1030 cm.sup.-.sup.1 and 950 cm.sup.-.sup.1, to that at 1230 cm.sup.-.sup.1, measured from a base line drawn between wave numbers of 1130 cm.sup.-.sup.1 and 1310 cm.sup.-.sup.1 which is less than about 0.1. These novel resins are prepared by the controlled addition of strong acids to thermosetting phenol-formaldehyde resins having a preponderance of benzyl ether linkages and an infrared spectrum exhibiting large adsorption at wave numbers of 1230 cm.sup.-.sup.1, 1050 cm.sup.-.sup.1 and 1010 cm.sup.-.sup.1, causing a decrease of at least 35% in the ratio of absorbance at 1010 cm.sup.-.sup.

Abstract: A rapidly curable phenol-formaldehyde resin is provided in the form of an emulsion which has particular utility in panel board production, particularly waferboard production.