Patents Assigned to Coretech Systems Co., Ltd.
  • Patent number: 11602908
    Abstract: The present disclosure provides a method of mesh generation for an RTM process, including operations of: obtaining a geometry of a target object; generating a solid mesh of the target object according to the geometry; obtaining material characteristics of the target object; assembling a runner mesh with the solid mesh, wherein the runner mesh has grid dimensions different from those of the solid mesh; determining process parameters of the RTM process; and generating a forecasted result of the RTM process according to the solid mesh, the runner mesh, the process parameters, and the material characteristics. Generating the solid mesh includes operations of: dividing the geometry into modules; generating a first and second modular meshes corresponding to a first and second modules, wherein the second modular mesh abuts the first modular mesh, and the second modular mesh has grid dimensions different from those of the first modular mesh.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: March 14, 2023
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Ching-Kai Chou, Chien-Ting Wu, Hsun Yang, Li-Hsuan Shen, Chih-Chung Hsu, Chia-Hsiang Hsu, Rong-Yeu Chang
  • Patent number: 11521903
    Abstract: The present disclosure provides a method of measuring a plurality of voids in an underfill material of an underfill package. The method includes operations of obtaining a welding angle profile of the underfill package; obtaining a simulated void profile of the underfill package according to the welding angle profile; determining a plurality of high-risk void regions according to the simulated void profile; simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region of the plurality of high-risk void regions to generate an updated void profile; and determining whether the updated void profile meets a void requirement of the underfill package.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: December 6, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Chien-Ting Wu, Ching-Kai Chou, Kai-Yi Bai, Wei-Yu Lin, Li-Hsuan Shen, Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11407156
    Abstract: The present disclosure provides an injection-molding system for preparing an injection-molded article using a computer-aided engineering (CAE) simulation. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate a stress distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the stress distribution of the molding resin is generated by taking into consideration an elastic effect of the molding resin; and a controller coupled to the processing module and configured to control the molding machine with the molding condition using the generated stress distribution of the molding resin to perform an actual molding process for preparing the injection-molded article.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: August 9, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11376777
    Abstract: A molding system includes a molding machine, a mold disposed on the molding machine, a processing module, and a controller operably communicating with the processing module. The molding machine includes a barrel, a screw moving within the barrel, a driving motor driving the screw to move a molding material. The mold has a mold cavity with a die swell structure for being filled with the molding material. The processing module simulating a filling process of the molding material based on a molding condition including a predetermined screw speed for the molding machine, wherein simulating the filling process of the molding material comprises simulating a die swell effect of the molding material in the die swell structure by taking into consideration of an effective factor, a shear viscosity, an extension viscosity, a shear rate, and a molecular orientation effect of the molding material.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: July 5, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11376776
    Abstract: The present disclosure provides a method of measuring a true shear viscosity profile of a molding material in a capillary and a molding system performing the same. The method includes the operations of: determining a setpoint temperature of the molding material before injecting into the capillary; obtaining an initial shear viscosity profile at the setpoint temperature with respect to a shear rate of the molding material; fitting an initial temperature profile with respect to the shear rate according to the initial shear viscosity based on Cross William-Landel-Ferry model; fitting a first shear viscosity profile and a first temperature profile with respect to the shear rate according to the initial temperature profile based on the Cross-WLF model; and setting the first shear viscosity profile as the true shear viscosity profile when a difference between the first temperature profile and the initial temperature profile is not greater than a threshold.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: July 5, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Chen-Chieh Wang, Yu-Ho Wen, Guo-Sian Cyue, Chih-Chung Hsu, Chia-Hsiang Hsu, Rong-Yeu Chang
  • Patent number: 11378505
    Abstract: The present disclosure provides a method of measuring an extensional viscosity of a polymer melt and a capillary injection system. The method includes the operations of: based on a weighted GNF viscosity model, obtaining a viscosity profile of the polymer melt according to a transport equation, a Navier Stokes equation, and a Trouton function; measuring a pressure drop of the polymer melt; obtaining a general viscosity of the polymer melt from the viscosity profile according to the pressure drop, wherein the general viscosity comprises a shear viscosity of the polymer melt and the extensional viscosity of the polymer melt; and extracting the extensional viscosity from the general viscosity.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: July 5, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11355361
    Abstract: The present disclosure provides a method for measuring an underfill profile of an underfill material in an underfill cavity having a plurality of solder bumps. The method includes the operations of: determining a mesh having a plurality of elements according to the underfill cavity; calculating a reference force according to the underfill cavity; obtaining a driving force and a flow speed of the underfill material according to a plurality of weighting factors and the reference force, wherein the plurality of weighting factors respectively correspond to the plurality of elements; obtaining a plurality of volume fractions respectively corresponding to the plurality of elements according to the flow speed; and obtaining the underfill profile according to the plurality of volume fractions.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: June 7, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Yu-En Liang, Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11230043
    Abstract: A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: January 25, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang
  • Patent number: 11230044
    Abstract: The present disclosure provides a method of producing a molded product. The method comprises steps of performing, via computer-assisted engineering simulation software, a first simulation process to generate a plurality of molding conditions comprising a default injection velocity profile and a default packing pressure profile; conducting, via an injection-molding apparatus, a trial molding to inject a molding material into a mold using the default molding conditions and sensing a plurality of in-mold pressures at different sites in a mold cavity of the mold; and conducting, via an injection-molding apparatus, an actual molding to produce the molded product using the default molding conditions if a deviation of the in-mold pressures at an endpoint of a packing stage is less than a target value.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: January 25, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Rong-Yeu Chang, Yuing Chang, Chia-Hsiang Hsu, Ting-Yu Cheng
  • Patent number: 11225005
    Abstract: A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: January 18, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang
  • Patent number: 11065795
    Abstract: The present disclosure provides a molding system for preparing an injection-molded plastic article. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin including a plurality of polymer chains; a processing module configured to generate an anisotropic viscosity distribution of the molding resin in the mold cavity based on a molding condition for the molding machine; wherein the anisotropic viscosity distribution of the molding resin is generated based in part on consideration of an integral effect of a volume fraction and an aspect ratio of the plurality of fibers; and a controller coupled to the processing module and configured to control the molding machine with the molding condition using the generated anisotropic viscosity distribution of the molding resin to perform an actual molding process for preparing the injection-molded plastic article.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: July 20, 2021
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11027470
    Abstract: A molding system includes a molding machine having a screw, a driving motor driving the screw to move a molding resin; a mold disposed on the molding machine and connected to the barrel of the molding machine to receive the molding resin, and having a mold cavity with a die swell structure for being filled with the molding resin; a processing module simulating a filling process of the molding resin from the barrel into the molding cavity based on a molding condition including a predetermined screw speed for the molding machine; and a controller operably communicating with the molding machine to control the driving motor of the molding machine based on the molding conditions to move the screw at the predetermined screw speed to transfer the molding resin at a corresponding flow rate to perform an actual molding process for preparing the injection-molded article.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: June 8, 2021
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 10987844
    Abstract: The present disclosure provides a clamping assembly in operative connection with a mold of an injection-molding apparatus. The clamping assembly includes a fixed plate, a rear plate, a plurality of tie bars, a movable plate, a driving module, and a temperature adjuster. The rear plate is spaced apart from the fixed plate. The tie bars are interlinked with the fixed plate and the rear plate and provided with a plurality of channels. The movable plate, between the fixed plate and the rear plate, is capable of moving with respect to the fixed plate along the tie bars. The driving module interlinks the rear plate and the movable plate. The temperature adjuster is employed to supply a fluid into the channels to remove heat from the tie bars, thereby preventing non-uniform thermal expansion of the tie bars, and hence preventing the structural wear and flash issues.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 27, 2021
    Assignee: Coretech System Co., Ltd.
    Inventors: Yuing Chang, Chih-Kang Lee, Chia-Hsiang Hsu, Rong-Yeu Chang
  • Patent number: 10960592
    Abstract: A computer-implemented simulation method for use in a molding process by a computer process is disclosed. The method includes steps of specifying a simulating domain comprising a mold cavity and a barrel of an injection machine, wherein the barrel is configured to connect to the mold cavity; creating at least one mesh by dividing at least part of the simulating domain; specifying boundary conditions of the mesh by taking into consideration at least one motion of a screw in the barrel; and simulating a first injection-molding process of a molding material by using the boundary conditions to generate a plurality of molding conditions.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 30, 2021
    Assignee: Coretech System Co., Ltd.
    Inventors: Chih-Chung Hsu, You-Sheng Zhou, Chia-Hsiang Hsu, Rong-Yeu Chang
  • Patent number: 10946597
    Abstract: The present disclosure provides a measurement method for a molding system comprising an upper mold and a lower mold forming a mold cavity. The method includes applying a pressure difference to a molding resin for driving the molding resin to flow into a preform in the mold cavity; detecting a flow front of the molding resin at a first position and a second position in the mold cavity; and calculating a flowing property of the molding resin based on the first position, the second position, a travelling time of the flow front from the first position to the second position, and the pressure difference.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: March 16, 2021
    Assignees: Coretech System Co., Ltd., National Tsing Hua University
    Inventors: Yuan Yao, Tzu-Heng Chiu, Rong-Yeu Chang, Chia-Hsiang Hsu, Chih-Wei Wang, Shih-Po Sun, Sung-Wei Huang, Hsun Yang, Tsai-Heng Tsai
  • Patent number: 10940623
    Abstract: The present disclosure provides a molding system for preparing molding articles. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate a mechanical pressure distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the mechanical pressure distribution of the molding resin is generated based in part on a bulk viscosity effect of the molding resin; and a controller operably communicating with the processing module and configured to operate the molding machine for transferring the fluid molding material into the mold cavity with the molding condition using the generated pressure distribution of the molding resin to perform an actual molding process for preparing the molding article.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: March 9, 2021
    Assignee: Coretech System Co., Ltd.
    Inventors: Yuan-Jung Chang, Rong-Yeu Chang, Chen-Chieh Wang, Chia-Hsiang Hsu
  • Patent number: 10919202
    Abstract: The present disclosure provides a molding system for preparing injection-molded articles. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate an anisotropic viscosity distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the anisotropic viscosity distribution of the molding resin is generated based in part on an elastic effect of the molding resin; and a controller operably communicating with the processing module and configured to control the molding machine with the molding condition using the generated anisotropic viscosity distribution of the molding resin to perform an actual molding process for preparing the injection-molded article.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: February 16, 2021
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 10864667
    Abstract: A molding system comprises a mold, a molding machine, a computing apparatus, and a controller. The computing apparatus is programmed to perform a first simulation to generate a velocity distribution and a temperature distribution of the molding material in a first portion of a simulating domain and a second simulation to generate a melting distribution of the solid decorating film in a second portion of the simulating domain, wherein the simulating domain corresponds to the mold cavity. The first molding simulation is to performed using a molding condition of the molding machine to set a boundary condition of the first portion, and the second molding simulation is performed using the velocity distribution and the temperature distribution of the molding material to set a boundary condition of the second portion.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: December 15, 2020
    Assignee: CORETECH SYSTEMS CO., LTD.
    Inventors: Chih-Chung Hsu, Tung-Huan Su, Hsien-Sen Chiu, Chia-Hsiang Hsu, Rong-Yeu Chang
  • Patent number: 10710285
    Abstract: The present disclosure provides a molding system for preparing injection-molded articles. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate a mixed anisotropic viscosity distribution of the molding resin in the mold cavity based on a molding condition for the molding machine; and a controller coupled to the processing module. The mixed anisotropic viscosity distribution of the molding resin is generated by taking into consideration an extension rate distribution and a shear rate distribution of the molding resin. The controller is configured to control the molding machine with the molding condition using the generated extension rate distribution and the generated shear rate distribution of the molding resin to perform an actual molding process for preparing the injection-molded article.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: July 14, 2020
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: D1003928
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: November 7, 2023
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Cheng-Kuang Lee, Chen-Chieh Wang, Chia-Hsiang Hsu, Rong-Yeu Chang