Patents Assigned to CORETRONIC MEMS CORPORATION
  • Force sensor having first and second circuit board arrangements
    Patent number: 11105692
    Abstract: A force sensor includes a sensing element, a first circuit board, and at least one second circuit board. The sensing element has a top surface and the bottom surface opposite to each other and has a sensing portion, wherein the sensing portion is located at the top surface. The first circuit board is disposed on the top surface and is electrically connected to the sensing element. The at least one second circuit board is connected to the first circuit board, wherein the at least one second circuit board shields the sensing element. The sensing portion is adapted to generate a sensing signal through an external force transferred from the first circuit board to the top surface.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: August 31, 2021
    Assignee: CORETRONIC MEMS CORPORATION
    Inventors: Hsi-Wen Tung, Wen-Pin Tsai, Ming-Ching Wu
  • FORCE SENSOR
    Publication number: 20200240856
    Abstract: A force sensor includes a sensing element, a first circuit board, and at least one second circuit board. The sensing element has a top surface and the bottom surface opposite to each other and has a sensing portion, wherein the sensing portion is located at the top surface. The first circuit board is disposed on the top surface and is electrically connected to the sensing element. The at least one second circuit board is connected to the first circuit board, wherein the at least one second circuit board shields the sensing element. The sensing portion is adapted to generate a sensing signal through an external force transferred from the first circuit board to the top surface.
    Type: Application
    Filed: March 15, 2019
    Publication date: July 30, 2020
    Applicant: CORETRONIC MEMS CORPORATION
    Inventors: Hsi-Wen Tung, Wen-Pin Tsai, Ming-Ching Wu