Abstract: There is disclosed a liquid cooled high power semi-conductor structure comprising multiple stacked semi-conductor devices each having at least one surface prepared with a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, there being multiple semi-conductor devices stacked with heat exchange surfaces of adjacent or semi-conductor devices opposing each other, said heat exchange surfaces being spaced apart to form a coolant conduit, the several coolant conduits being fed coolant in parallel by a common input conduit and the discharge coolant feeding in parallel into a common discharge conduit, said stacked semi-conductor devices being electrically connected in series or some combination of series parallel.

Abstract: There is disclosed a liquid cooled multi-chip semi-conductor module comprising multiple semi-conductor devices each having one surface prepared with electrical interconnect means for mechanical and electrical attachment to an electrical interconnect substrate, said semi-conductor device having a surface opposing said surface prepared with said electrical interconnect means, said opposing surface being a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, one surface of said conduit having apertures corresponding in placement and geometry to said heat transfer surfaces of said semi-conductor devices mounted on said electrical interconnect means wherein said heat transfer surfaces and said conduit surface containing said apertures are approximately coincident thereby providing an approximate

Abstract: There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink of modular construction suitable for semi-conductor chips such as IC's, hybrids, lasers, and power semi-conductors, said modular heat sink containing inserts with chip substrates made of metals, such as tungsten or molybdenum, said substrate including at least one surface suitable for bonding one or more semi-conductor chips in intimate thermal relationship thereto, and including a heat exchange surface on the interior surface thereof, said module providing means for enclosing said heat exchange surface in a liquid tight manner and including means for providing a flow of coolant liquid to remove heat from said heat exchange surface by formation of nucleate vapor bubbles on said heat exchange surface, the improvement wherein said heat sink module comprises individual heat sink inserts upon which semi-conductor chips are intimately bonded, said heat sink element being provided with means to electrically isolate each heat sink eleme

Abstract: There is disclosed a wafer scale semi-conductor module stack comprising at least one wafer scale semi-conductor device mounted on each of the two surfaces of an electrical interconnect substrate, said devices having their active devices facing said substrate with means being provided whereby said substrate and said devices are electrically and mechanically attached, the opposing surfaces of said devices being the heat exchange surfaces wherein heat is removed by flowing two-phase cooling, and there being multiple substrates positioned parallel to each other and sharing a common axis, each substrate being spaced apart such as to provide a conduit between opposing devices for the flow of coolant and said conduits being fed by an input conduit with coolant discharge through an output conduit, said substrates being attached to common support posts.