Patents Assigned to Corning Incoporated
  • Patent number: 9312044
    Abstract: A formulation including: an organic semiconducting polymer selected from the diketopyrrolopyrrole (DPP) and fused thiophene co-polymer structures of the formulas (I), (II), or combinations thereof, or salts thereof, in an amount of from 0.1 to 5 wt % based on the total weight of the formulation: formulas (I) and (II), respectively, where m is an integer from 1 to 2, n is an integer from 4 to 80, X and Y are independently selected from a divalent heteroaryl, such as a thiophene, R1, R2, R3, and R4 is each a hydrocarbylene substituent as defined herein, a first solvent is selected from a cyclic aliphatic in an amount of from 2 to 98 wt %; and a second solvent selected from an aromatic in an amount of from 98 to 2 wt %. Also disclosed are method of making and using the disclosed formulations, for example, for use in electronic devices.
    Type: Grant
    Filed: August 20, 2013
    Date of Patent: April 12, 2016
    Assignee: Corning Incoporated
    Inventors: Mingqian He, James Robert Matthews
  • Patent number: 6982439
    Abstract: A tunnel junction device (102) with minimal hydrogen passivation of acceptors includes a p-type tunnel junction layer (106) of a first semiconductor material doped with carbon. The first semiconductor material includes aluminum, gallium, arsenic and antimony. An n-type tunnel junction layer (104) of a second semiconductor material includes indium, gallium, arsenic and one of aluminum and phosphorous. The junction between the p-type and an-type tunnel junction layers forms a tunnel junction (110).
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: January 3, 2006
    Assignee: Corning Incoporated
    Inventors: Rajaram Bhat, Nobuhiko Nishiyama