Abstract: Bi-directional data center architectures employing a jacketless trunk cable are disclosed. The bi-directional data center architecture includes first and second coupling panels respectively having first adapters and second adapters. The architecture also includes a plurality of sub-racks having sub-rack adapters, and a jacketless trunk cable that includes a plurality of sub-unit sections, with each sub-unit section carrying one or more optical fibers. The plurality of sub-unit sections are configured to optically connect corresponding first and second adapters of the first and second coupling panels to the sub-rack adapters such that every optical fiber in each sub-unit section is used to establish an optical connection.

Abstract: Preparation of halogen-doped silica is described. The preparation includes doping silica with high halogen concentration and sintering halogen-doped silica to a closed-pore state. The sintering includes a high pressure sintering treatment and a low pressure sintering treatment. The high pressure sintering treatment is conducted in the presence of a high partial pressure of a gas-phase halogen doping precursor and densifies a silica soot body to a partially consolidated state. The low pressure sintering treatment is conducted in the presence of a low partial pressure of gas-phase halogen doping precursor and transforms a partially consolidated silica body to a closed-pore state. The product halogen-doped silica glass exhibits little foaming when heated to form fibers in a draw process or core canes in a redraw process.

Abstract: An article that includes: an inorganic oxide substrate having opposing major surfaces; and an optical film structure disposed on a first major surface of the substrate, the optical film structure comprising one or more of a silicon-containing oxide, a silicon-containing nitride and a silicon-containing oxynitride and a physical thickness from about 50 nm to less than 500 nm. The article exhibits a hardness of 8 GPa or greater measured at an indentation depth of about 100 nm or a maximum hardness of 9 GPa or greater measured over an indentation depth range from about 100 nm to about 500 nm, the hardness and the maximum hardness measured by a Berkovich Indenter Hardness Test. Further, the article exhibits a single-side photopic average reflectance that is less than 1%.

Abstract: Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion.

Abstract: A method for forming a plugged honeycomb article includes feeding a ceramic precursor material through an extrusion die, the extrusion die having a plurality of pins, a plurality of cavities bounded by adjacent pins, and alternating end-faces of the plurality of pins include extensions extending from an outlet of the extrusion die in an extrusion direction. The method further includes extruding the ceramic precursor material through the extrusion die to form a web structure comprising a plurality of cell walls and channels bounded by adjacent cell walls, supporting the web structure that has been extruded through the extrusion die, and providing movement between the extrusion die and the web structure in at least one direction substantially orthogonal to the extrusion direction while the extensions are positioned in at least a portion of the channels.

Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.

Abstract: A method for coating a surface of a cell culture article includes dissolving a polymer having a covalently attached polypeptide in an aqueous solution to produce a polymer solution. The polymer is formed from monomers selected to form a polymer having a linear backbone, wherein the polymer is crosslink free. The weight percentage of the polypeptide relative to the polymer conjugated to the polypeptide is sufficiently high to render the polymer conjugated to the polypeptide water soluble. The aqueous solution is substantially free of organic solvents. The method further includes (i) disposing the polymer solution on the surface of the cell culture article to produce a coated article; and (ii) subjecting the coated article to sufficient heat or electromagnetic radiation to attach the polymer conjugated to a polypeptide to the surface of the cell culture article.

Abstract: A honeycomb body having intersecting porous walls which includes first through fourth cells, wherein the cells extend from inlet to outlet face and are plugged to define a repeating structural unit with three inlets and one outlet channel. Repeating structural unit includes a first channel including length L1, width W2, and area A1, a second channel including length L2, the width W2, and area A2, a third channel including the length L1, width W1, and area A3, and a fourth channel including the length L2, the width W1, and A4, wherein the first through third channels are inlets and the fourth channel is a rectangular outlet and at least one of W1>W2 and L1?L2, i.e. W1>W2, or L1?L2, or W1>W2 and L1?L2. Repeating structural unit has a quadrilateral outer perimeter. Particulate filters including the honeycomb body, honeycomb extrusion dies, and methods of manufacturing the honeycomb body are provided.

Abstract: A shingle coating asphalt composition is provided that is produced from a paving grade asphalt. The asphalt composition comprises a paving-grade asphalt that has been modified with one or more polymer additives; and a secondary additive comprising one or more of a viscosity reducing agent, a wax, a salt of a fatty acid ester, and an amide of a fatty acid. The shingle coating asphalt coating composition is used to make a shingle. The shingle includes a substrate, the asphalt, and roofing granules.

Abstract: A glass wafer having a first major surface, a second major surface that is parallel to and opposite of the first major surface, a thickness between the first major surface and the second major surface, and an annular edge portion that extends from an outermost diameter of the glass wafer toward the geometrical center of the glass wafer. The glass wafer has a diameter from greater than or equal to 175 mm to less than or equal to 325 mm and a thickness of less than 0.350 mm. A width of the edge portion is less than 10 mm.

Abstract: Glass-based articles article are described and have a first surface and a second surface opposing the first surface defining a thickness (t) (mm); and a compressive stress (CS) layer containing ion-exchanged potassium and ion-exchanged silver or ion-exchanged potassium and ion-exchanged copper, the CS layer extending from the first surface to a depth of compress (DOC), wherein the DOC is in a range of 0.1·t and 0.3·t, the CS at the first surface in a range of 300 MPa and 1500 MPa and defining a compressive stress profile including a spike region, a tail region and a knee region between the spike region and the tail region, wherein all points of the stress profile in the spike region comprise a tangent having a value that is in a range of ?15 MPa/micrometer and ?200 MPa/micrometer and all points in the tail region comprise a tangent having a value that is in a range of ?0.01 MPa/micrometer and ?3 MPa/micrometer.

Abstract: Embodiments of an electronic device comprising an enclosure and electrical components disposed at least partially inside the enclosure, wherein the enclosure comprises a substrate having a tactile surface are disclosed. The tactile surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the tactile surface. In one or more embodiments, the substrate exhibits an average transmittance of about 80% or greater over the visible spectrum, a coefficient of friction less than about 0.3, a surface roughness Ra of about 500 nm or greater, and either one or both a transmission haze greater than about 60%, and a reflection haze at either 2 degrees from specular or 5 degrees from specular greater than 60%.

Abstract: An augmented reality optical system comprises a waveguide structure that includes a waveguide layer supported by a substrate. An input grating and an output grating reside within the waveguide layer and are laterally spaced apart. Input light from a display is made incident upon the input grating. The input light is coupled into the waveguide layer and travels therein as multiple guided modes to the output grating. The input and output gratings provide phase matching so that the guided modes are coupled out of the waveguide layer by the output grating continuously along the output grating to form output light. Meantime, light from a scene is transmitted perpendicularly through the output grating so that the output light and the light from the scene are combined by the eye of a user to form an augmented reality image.

Abstract: Disclosed herein is a bottom-up electrolytic via plating method wherein a first carrier substrate and a second substrate having at least one through-via are temporarily bonded together. The method includes applying a seed layer on a surface of the first substrate, forming a surface modification layer on the seed layer or the second substrate, bonding the second substrate to the first substrate with the surface modification layer to create an assembly wherein the seed layer and the surface modification layer are disposed between the first and second substrates, applying conductive material to the through-via, removing the second substrate having the through-via containing conductive material from the assembly.

Abstract: An article includes a substrate; a first layer disposed on the first major surface of the substrate, wherein the first layer has an adherence to the substrate of greater than or equal to 4B according to a cross hatch adhesion test set forth in ASTM D3359-17; and at least one ink layer disposed on the first layer having a surface roughness Ra greater than or equal 50 nm to provide a textured surface. Also disclosed is an article a substrate a coating disposed on the first major surface, wherein the coating has an adherence to the substrate of greater than or equal to 4B according to a cross hatch adhesion test set, a gauge hardness greater than or equal to 4H according to a pencil test, and a scratch hardness greater than or equal to 3H according to a pencil test set.

Abstract: According to one or more embodiments described herein, a coated article may comprise: a transparent substrate having a major surface, the major surface comprising a textured or rough surface inducing light scattering; and an optical coating disposed on the major surface of the transparent substrate and forming an air-side surface, the optical coating comprising one or more layers of material, the optical coating having a physical thickness of greater than 300 nm, wherein the coated article exhibits a maximum hardness of about 10 GPa or greater as measured on the air-side surface by a Berkovich Indenter Hardness Test along an indentation depth of about 50 nm or greater.

Abstract: Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.

Abstract: A method is described for selecting fibers meeting requirements of a second minimum bandwidth at a second wavelength based on differential mode delay data measured at a first wavelength different from the second wavelength.

Abstract: Methods of manufacturing multi-mode optical fiber, and multi-mode optical fiber produced thereby, are disclosed. According to embodiments, a method for forming an optical fiber may include heating a multi-mode optical fiber preform and applying a draw tension to a root of the multi-mode optical fiber preform on a long axis of the multi-mode optical fiber preform thereby drawing a multi-mode optical fiber from the root of the multi-mode optical fiber preform. The draw tension may be modulated while the multi-mode optical fiber is drawn from the root of the multi-mode optical fiber preform. Modulating the draw tension introduces stress perturbations in the multi-mode optical fiber and corresponding refractive index perturbations in a core of the multi-mode optical fiber.