Abstract: A method and apparatus are provided for monitoring an optical signal from a solid state laser. The method includes the steps of providing a planar substrate defined by opposing planar surfaces and a substrate edge that together define a substrate volume that is transparent to an optical signal from the solid state laser, disposing the solid state laser on one of the opposing planar surfaces the planar substrate such that a first portion of the optical signal travels directly through the planar substrate substantially orthogonal to the opposing planar surfaces and a second portion of the optical signal is reflected between the opposing planar surfaces of the planar substrate and passes out of the substrate through the substrate edge, and disposing an optical detector proximate the edge of the planar substrate to detect the second portion of the optical signal.

Abstract: A method and apparatus are provided for transmitting an optical communications signal. The method includes the steps of disposing a plurality of optical gratings on a surface of an optically transparent substrate, disposing an optical array having a plurality of optical ports adjacent the optically transparent substrate such that an axis of transmission of the optical array passes directly through the substrate, and transmitting a plurality of optical signals of the optical array substantially through the plurality of optical gratings in the substrate.

Abstract: An electro-optical converter assembly is described. The electro-optic converter includes an optically transparent substrate with a plurality of alignment apertures and an optical device disposed on a first planar surface of the optically transparent substrate in alignment with the plurality of alignment apertures so that an axis of transmission of the optical device passes directly through the optically transparent substrate.

Abstract: A method and apparatus are provided for transmitting an optical communications signal. The method includes the steps of securing an optical device onto an optically transparent substrate with an optically transparent adhesive such that an axis of transmission of the optical device passes directly through the optically transparent adhesive and a portion of the body of the optically transparent substrate, darkening a portion of the optically transparent adhesive with a laser; and transmitting light from the optical device through the darkened portion of the optically transparent adhesive such that at least some of the light from the optical device is absorbed by the darkened portion.

Abstract: A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically trasparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures.

Abstract: A method and apparatus are provided for optically interlocking a plug and receptacle combination. The method includes the steps of disposing an optical source and receiver in a sidewall of the receptacle with an axis of transmission from the optical source to the receiver directed into and across a plug space of the receptacle substantially perpendicular to an axis of insertion of the plug and activating the optical interlock when an optical signal from the optical source is detected by the optical receiver.

Abstract: A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically trasparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures.

Abstract: A method and apparatus are provided for aligning a set of connector guide pins to an optical array, The method comprises the steps of disposing the optical array on a transparent substrate such that an axis of transmission of the optical array passes directly through the transparent substrate, disposing a heatsink with a set of alignment guide pins on a rear surface of the optical array with the set of alignment guide pins extending through the transparent substrate on either side of the optical array, and slotting a set of holes where the set of alignment guide pins extends through the transparent substrate to allow for thermal expansion.

Abstract: A method and apparatus are provided for aligning a plurality of transmission paths of an array of optical devices with a plurality of optical fibers. The method includes the steps of disposing the optical array on a first side of the transparent substrate with the plurality of optical transmission paths passing directly through the substrate, disposing a signal processor on the first side of the transparent substrate adjacent the array of optical devices, disposing a set of alignment guides on a second side of the transparent substrate parallel to the plurality of transmission paths for aligning the plurality of optical fibers with the plurality of transmission paths and coupling a plurality of signals processed by the processor through the plurality of transmission paths between the optical array and plurality of optical fibers.

Abstract: A method and apparatus are provided for aligning an array of optical devices with optical processing equipment. The method includes the steps of providing a transparent substrate with a plurality of optical transmission paths passing directly through the substrate, providing a plurality of alignment guides on the optical array, providing a complementary plurality of respective alignment guides on the transparent substrate and guiding the optical devices of the array into alignment with the substrate using respective pairs of the alignment guides on the optical array and transparent substrate.

Abstract: A method and apparatus are provided for transporting a plurality of information signals among a plurality of signal processing boards all located within a single cabinet of an information processing system. The method includes the steps of connecting a plurality of multi-mode fibers among the plurality of signal processing boards and electrooptically converting an information signal of the plurality of transported information signals between an electrical format used on a corresponding pair of signal processing boards of the plurality of signal processing boards and an optical format used for transmission through a corresponding multi-mode fiber of the plurality of multi-mode fibers. The method further includes the step of optically switching a transported information signal of the transported information signals between a set of multi-mode fibers of the plurality of multi-mode fibers.

Abstract: A method and apparatus are provided for providing an electro-optic signal processing assembly. The method includes the steps of providing an optically transparent substrate with a plurality of alignment apertures formed in the substrate, disposing a guide pin in each of the plurality of alignment apertures, providing an optical device with a transmission path of the optical device passing directly through the body of the optically transparent substrate, aligning an optical fiber holder to the optical device using the guide pins and guide pin apertures, and coupling an optical signal of the optical device of the optical array to a respective optical fiber of the aligned optical fiber holder.

Abstract: A method and apparatus are provided for providing an electro-optic interface for exchanging information signals. The method includes the steps of disposing an optical array adjacent a first side of an optically transparent substrate, such that a plurality of transmission paths of the optical array pass directly through the substrate, applying an optically transparent underfill between the substrate and adjacent optical array with the plurality of transmission paths of the optical array passing directly through the underfill and coupling a plurality of optical signals of the optical array through the optically transparent underfill and optically transparent substrate between the optical array and an optical connector.

Abstract: A method and apparatus are provided for aligning an optical array with a substrate. The method includes the steps of aligning the substrate with a set of alignment structures on an alignment fixture, transmitting a plurality of optical signals from the fixture through the substrate, and automatically aligning the optical array to the substrate using the transmitted plurality of optical signals and a pick and place machine.

Abstract: A method and apparatus are provided for aligning a plurality of transmission paths of an array of optical devices with a plurality of optical fibers. The method includes the steps of disposing the optical array on a first side of the transparent substrate with the plurality of optical transmission paths passing directly through the substrate, disposing a signal processor on the first side of the transparent substrate adjacent the array of optical devices, disposing a set of alignment guides on a second side of the transparent substrate parallel to the plurality of transmission paths for aligning the plurality of optical fibers with the plurality of transmission paths and coupling a plurality of signals processed by the processor through the plurality of transmission paths between the optical array and plurality of optical fibers.

Abstract: A method and apparatus are provided for aligning an array of optical devices with optical processing equipment. The method includes the steps of providing a transparent substrate with a plurality of optical transmission paths passing directly through the substrate, providing a plurality of alignment guides on the optical array, providing a complementary plurality of respective alignment guides on the transparent substrate and guiding the optical devices of the array into alignment with the substrate using respective pairs of the alignment guides on the optical array and transparent substrate.

Abstract: A method and apparatus are provided for amplifying a first optical signal having a first wavelength and a second optical signal having a second wavelength. The method includes the steps of routing the first and second optical signal into a first and second optical amplifier coupled in parallel and amplifying the first optical signal at the first wavelength in the first optical amplifier and the second optical signal at the second wavelength in the second optical amplifier.

Abstract: A method and apparatus are provided for aligning a set of connector guide pins to an optical array, The method comprises the steps of disposing the optical array on a transparent substrate such that an axis of transmission of the optical array passes directly through the transparent substrate, disposing a heatsink with a set of alignment guide pins on a rear surface of the optical array with the set of alignment guide pins extending through the transparent substrate on either side of the optical array, and slotting a set of holes where the set of alignment guide pins extends through the transparent substrate to allow for thermal expansion.

Abstract: A method and apparatus are provided for transporting a plurality of information signals among a plurality of signal processing boards all located within a single cabinet of an information processing system. The method includes the steps of connecting a plurality of multi-mode fibers among the plurality of signal processing boards and electrooptically converting an information signal of the plurality of transported information signals between an electrical format used on a corresponding pair of signal processing boards of the plurality of signal processing boards and an optical format used for transmission through a corresponding multi-mode fiber of the plurality of multi-mode fibers. The method further includes the step of optically switching a transported information signal of the transported information signals between a set of multi-mode fibers of the plurality of multi-mode fibers.

Abstract: A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically transparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first surface of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures.