Patents Assigned to Corropak, Inc.
  • Void fill material and process for manufacturing same
    Patent number: 5946994
    Abstract: Void fill material is used to cushion and protect packages during transport and delivery. A void fill material is shown, as well as a process for manufacturing same.
    Type: Grant
    Filed: August 8, 1994
    Date of Patent: September 7, 1999
    Assignee: Corropak, Inc.
    Inventors: Russell Wells Tether, Gregory Scott Herbig
  • Void fill material
    Patent number: 5254389
    Abstract: A void fill material (10) can be formed from ordinary scrap cardboard into an interlocking packaging material. Each piece of the material (10) has a primary section (20) defining a primary plane. The void fill has at least two limbs extending from the primary section. The void fill can be in any geometric shape, such as a block Y (10), a block H (62), an angled Y (80), an X (100), and a cross (120). Scoring can be applied to the void material at any location, thereby facilitating the deformation of the void fill.
    Type: Grant
    Filed: October 13, 1992
    Date of Patent: October 19, 1993
    Assignee: Corropak, Inc.
    Inventor: Russell W. Tether