Abstract: A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.

Abstract: A method and system for managing memory modules or memory devices is disclosed. The memory modules or memory devices are managed by using a microcontroller on the memory module. A user can remotely control the memory module by sending instructions and data to the microcontroller. The microcontroller can cause the measurement of a number of operational parameters of the memory module. The values of the measured operational parameters can be displayed on a display unit that is attached to the memory module or displayed on a screen associated with the host system.